DF3026X25V Renesas Electronics America, DF3026X25V Datasheet - Page 511
![MCU 3V 256K PB-FREE 100-TQFP](/photos/28/61/286123/100-tqfp__100-vqfp_sml.jpg)
DF3026X25V
Manufacturer Part Number
DF3026X25V
Description
MCU 3V 256K PB-FREE 100-TQFP
Manufacturer
Renesas Electronics America
Series
H8® H8/300Hr
Specifications of DF3026X25V
Core Processor
H8/300H
Core Size
16-Bit
Speed
25MHz
Connectivity
SCI, SmartCard
Peripherals
PWM, WDT
Number Of I /o
70
Program Memory Size
256KB (256K x 8)
Program Memory Type
FLASH
Ram Size
8K x 8
Voltage - Supply (vcc/vdd)
3 V ~ 3.6 V
Data Converters
A/D 8x10b; D/A 2x8b
Oscillator Type
Internal
Operating Temperature
-20°C ~ 75°C
Package / Case
100-TQFP, 100-VQFP
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Eeprom Size
-
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Company:
Part Number:
DF3026X25V
Manufacturer:
Renesas Electronics America
Quantity:
10 000
- Current page: 511 of 843
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16.1
The H8/3024 Group has high-speed static RAM on-chip. The RAM is connected to the CPU by a
16-bit data bus. The CPU accesses both byte data and word data in two states, making the RAM
useful for rapid data transfer.
The on-chip RAM can be enabled or disabled with the RAM enable bit (RAME) in the system
control register (SYSCR). When the on-chip RAM is disabled, that area is assigned to external
space in the expanded modes. The on-chip RAM specifications for the product lineup are shown
in table 16.1.
Table 16.1 H8/3024 Group On-Chip RAM Specifications
RAM size
Address
assignment
Overview
Modes 1, 2, 7
Modes 3, 4, 5
Mode 6
H8/3024F-ZTAT
4 kbytes
H'FEF20
to
H'FFF1F
H'FFEF20
to
H'FFFF1F
H'FE20
to
H'FF1F
Section 16 RAM
H8/3024 Mask
ROM Version
4 kbytes
H'FEF20
to
H'FFF1F
H'FFEF20
to
H'FFFF1F
H'FE20
to
H'FF1F
Rev. 2.00 Sep 20, 2005 page 471 of 800
H8/3026F-ZTAT
8 kbytes
H'FDF20
to
H'FFF1F
H'FFDF20
to
H'FFFF1F
H'FD20
to
H'FF1F
REJ09B0260-0200
Section 16 RAM
H8/3026 Mask
ROM Version
8 kbytes
H'FDF20
to
H'FFF1F
H'FFDF20
to
H'FFFF1F
H'FD20
to
H'FF1F
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