DF3026X25V Renesas Electronics America, DF3026X25V Datasheet - Page 32
![MCU 3V 256K PB-FREE 100-TQFP](/photos/28/61/286123/100-tqfp__100-vqfp_sml.jpg)
DF3026X25V
Manufacturer Part Number
DF3026X25V
Description
MCU 3V 256K PB-FREE 100-TQFP
Manufacturer
Renesas Electronics America
Series
H8® H8/300Hr
Specifications of DF3026X25V
Core Processor
H8/300H
Core Size
16-Bit
Speed
25MHz
Connectivity
SCI, SmartCard
Peripherals
PWM, WDT
Number Of I /o
70
Program Memory Size
256KB (256K x 8)
Program Memory Type
FLASH
Ram Size
8K x 8
Voltage - Supply (vcc/vdd)
3 V ~ 3.6 V
Data Converters
A/D 8x10b; D/A 2x8b
Oscillator Type
Internal
Operating Temperature
-20°C ~ 75°C
Package / Case
100-TQFP, 100-VQFP
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Eeprom Size
-
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Company:
Part Number:
DF3026X25V
Manufacturer:
Renesas Electronics America
Quantity:
10 000
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Figure 17.16 Power-On/Off Timing (Boot Mode).................................................................... 523
Figure 17.17 Power-On/Off Timing (User Program Mode) ..................................................... 524
Figure 17.18 Mode Transition Timing
Figure 17.19 ROM Block Diagram (H8/3026 Mask ROM Version)........................................ 526
Figure 17.20 Mask ROM Addresses and Data.......................................................................... 527
Section 18 Flash Memory [H8/3024F-ZTAT Version]
Figure 18.1
Figure 18.2
Figure 18.3
Figure 18.4
Figure 18.5
Figure 18.6
Figure 18.7
Figure 18.8
Figure 18.9
Figure 18.10 FLMCR1 Bit Settings and State Transitions ....................................................... 556
Figure 18.11 Program/Program-Verify Flowchart (128-Byte Programming)........................... 561
Figure 18.12 Erase/Erase-Verify Flowchart (Single-Block Erasing) ........................................ 564
Figure 18.13 Flash Memory State Transitions (When High Level is Applied to FWE Pin
Figure 18.14 Example of RAM Overlap Operation .................................................................. 569
Figure 18.15 Memory Map in PROM Mode............................................................................. 572
Figure 18.16 Power-On/Off Timing (Boot Mode).................................................................... 576
Figure 18.17 Power-On/Off Timing (User Program Mode) ..................................................... 577
Figure 18.18 Mode Transition Timing
Section 19 Clock Pulse Generator
Figure 19.1
Figure 19.2
Figure 19.3
Figure 19.4
Figure 19.5
Figure 19.6
Figure 19.7
Section 20 Power-Down State
Figure 20.1
Figure 20.2
Rev. 2.00 Sep 20, 2005 page xxx of xxxviii
(Example: Boot Mode
Block Diagram of Flash Memory ........................................................................ 531
Example of ROM Area/RAM Area Overlap ....................................................... 541
Flash Memory Related State Transitions............................................................. 542
Reading Overlap RAM Data in User Mode/User Program Mode ....................... 545
Writing Overlap RAM Data in User Program Mode ........................................... 546
System Configuration When Using Boot Mode .................................................. 548
Boot Mode Execution Procedure......................................................................... 549
RAM Areas in Boot Mode................................................................................... 551
Example of User Program Mode Execution Procedure ....................................... 554
in Mode 5 or 7 (On-Chip ROM Enabled))........................................................... 568
(Example: Boot Mode
Block Diagram of Clock Pulse Generator ........................................................... 582
Connection of Crystal Resonator (Example) ....................................................... 583
Crystal Resonator Equivalent Circuit .................................................................. 584
Oscillator Circuit Block Board Design Precautions ............................................ 584
External Clock Input (Examples) ........................................................................ 585
External Clock Input Timing ............................................................................... 587
External Clock Output Settling Delay Timing..................................................... 587
NMI Timing for Software Standby Mode (Example).......................................... 601
Hardware Standby Mode Timing......................................................................... 603
User Mode
User Mode
User Program Mode) .......................... 525
User Program Mode) .......................... 578
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