ISP1362BDTM STEricsson, ISP1362BDTM Datasheet - Page 137

• Manufacturer Part Number: ISP1362BDTM
• Manufacturer: STEricsson

Specifications of ISP1362BDTM

• Operating Temperature (min): -40C
• Operating Temperature Classification: Industrial
• Operating Temperature (max): 85C
• Package Type: LQFP
• Rad Hardened: No
• Lead Free Status / RoHS Status: Compliant

Fig 40. Package outline SOT543-1 (TFBGA64)
ISP1362_7
Product data sheet
TFBGA64: plastic thin fine-pitch ball grid array package; 64 balls; body 6 x 6 x 0.8 mm
DIMENSIONS (mm are the original dimensions)
UNIT
mm
OUTLINE
VERSION
SOT543-1
max.
ball A1
index area
ball A1
index area
1.1
A
0.25
0.15
A 1
K
H
G
D
C
B
A
E
J
F
0.85
0.75
A 2
1
- - -
IEC
0.35
0.25
2
b
3
e
4
6.1
5.9
D
5
e 1
D
6
6.1
5.9
E
1/2
MO-195
7
JEDEC
e
8 9 10
0.5
e
b
0
Rev. 07 — 29 September 2009
REFERENCES
4.5
e 1
4.5
e 2
1/2
B
e
JEITA
scale
e
- - -
2.5
∅
∅
A
E
w
e 2
0.15
v
v
M
M
C
C
0.05
w
A
B
5 mm
0.08
y
A
A 2
0.1
y 1
y 1 C
A
1
Single-chip USB OTG controller
PROJECTION
detail X
EUROPEAN
X
C
© ST-ERICSSON 2009. All rights reserved.
y
ISP1362
ISSUE DATE
00-11-22
02-04-09
SOT543-1
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