D13007VX13V Renesas Electronics America, D13007VX13V Datasheet - Page 781

• Manufacturer Part Number: D13007VX13V
• Description: MCU 3V 0K 100-TQFP
• Manufacturer: Renesas Electronics America
• Series: H8® H8/300Hr

Specifications of D13007VX13V

• Core Processor: H8/300H
• Core Size: 16-Bit
• Speed: 13MHz
• Connectivity: SCI, SmartCard
• Peripherals: DMA, PWM, WDT
• Number Of I /o: 35
• Program Memory Type: ROMless
• Ram Size: 4K x 8
• Voltage - Supply (vcc/vdd): 2.7 V ~ 5.5 V
• Data Converters: A/D 8x10b; D/A 2x8b
• Oscillator Type: Internal
• Operating Temperature: -20°C ~ 75°C
• Package / Case: 100-TQFP, 100-VQFP
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Eeprom Size: -
• Program Memory Size: -

Modes 3 and 4: Figure D.2 is a timing diagram for the case in which RES goes low during an
external memory access in mode 3 or 4. As soon as RES goes low, all ports are initialized to the
input state. AS, RD, HWR, LWR, and CS
The address bus is initialized to the low output level 2.5 φ clock cycles after the low level of RES
is sampled. However, when PA
PB
low. Clock pin P6
3
are used as CS output pins, they go to the high-impedance state at the same time as RES goes
P6
RES
Internal reset
signal
A
CS
AS, RD
(read)
HWR, LWR
(write)
D
(write)
I/O port,
PA
A
20
21
15
7
4
0
, CS
/φ
/A
to A
to D
23
7
0
0
to PA
to CS
7
Figure D.2 Reset during Memory Access (Modes 3 and 4)
/φ goes to the output state at the next rise of φ after RES goes low.
6
1
/
4
to PA
Access to external
T1
6
are used as address bus pins, or when P8
0
memory
go high, and D
T2
T3
Rev.5.00 Sep. 12, 2007 Page 751 of 764
15
to D
0
go to the high-impedance state.
High impedance
High impedance
H'000000
Appendix D Pin States
REJ09B0396-0500
3
to P8
1
and PB
0
to