D13007VX13V Renesas Electronics America, D13007VX13V Datasheet - Page 187

• Manufacturer Part Number: D13007VX13V
• Description: MCU 3V 0K 100-TQFP
• Manufacturer: Renesas Electronics America
• Series: H8® H8/300Hr

Specifications of D13007VX13V

• Core Processor: H8/300H
• Core Size: 16-Bit
• Speed: 13MHz
• Connectivity: SCI, SmartCard
• Peripherals: DMA, PWM, WDT
• Number Of I /o: 35
• Program Memory Type: ROMless
• Ram Size: 4K x 8
• Voltage - Supply (vcc/vdd): 2.7 V ~ 5.5 V
• Data Converters: A/D 8x10b; D/A 2x8b
• Oscillator Type: Internal
• Operating Temperature: -20°C ~ 75°C
• Package / Case: 100-TQFP, 100-VQFP
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Eeprom Size: -
• Program Memory Size: -

6. Bus Controller
External space
access
DRAM access
DRAM access
T
Tr
T
T
T
T
T
T
p
c1
c2
1
2
c1
c2
φ
A
to A
23
0
AS
CSn (RAS)
PB4/PB5
(UCAS/LCAS)
D
to D
15
0
Note: n = 2 to 5
Figure 6.21 Example of Operation Timing in RAS Down Mode (CSEL = 0)
When RAS down mode is selected, the conditions for an asserted RASn signal to return to the
high level are as shown below. The timing in these cases is shown in figure 6.22.
⎯ When DRAM space with a different row address is accessed
⎯ Immediately before a CAS-before-RAS refresh cycle
⎯ When the BE bit or RDM bit is cleared to 0 in DRCRA
⎯ Immediately before release of the external bus
Rev.5.00 Sep. 12, 2007 Page 157 of 764
REJ09B0396-0500