D13007VX13V Renesas Electronics America, D13007VX13V Datasheet - Page 623

• Manufacturer Part Number: D13007VX13V
• Description: MCU 3V 0K 100-TQFP
• Manufacturer: Renesas Electronics America
• Series: H8® H8/300Hr

Specifications of D13007VX13V

• Core Processor: H8/300H
• Core Size: 16-Bit
• Speed: 13MHz
• Connectivity: SCI, SmartCard
• Peripherals: DMA, PWM, WDT
• Number Of I /o: 35
• Program Memory Type: ROMless
• Ram Size: 4K x 8
• Voltage - Supply (vcc/vdd): 2.7 V ~ 5.5 V
• Data Converters: A/D 8x10b; D/A 2x8b
• Oscillator Type: Internal
• Operating Temperature: -20°C ~ 75°C
• Package / Case: 100-TQFP, 100-VQFP
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Eeprom Size: -
• Program Memory Size: -

20.3.3
Bus timing is shown as follows:
• Basic bus cycle: two-state access
• Basic bus cycle: three-state access
• Basic bus cycle: three-state access with one wait state
• Burst ROM access timing: burst cycle two-state
• Burst ROM access timing: burst cycle three-state
• Bus-release mode timing
φ
NMI
IRQ
IRQ
Figure 20.8 shows the timing of the external two-state access cycle.
Figure 20.9 shows the timing of the external three-state access cycle.
Figure 20.10 shows the timing of the external three-state access cycle with one wait state
inserted.
Figure 20.11 shows the timing of the burst cycle two-state access.
Figure 20.12 shows the timing of the burst cycle three-state access.
Figure 20.13 shows the bus-release mode timing.
E
L
IRQ : Edge-sensitive IRQ
IRQ
(j = 0 to 5)
NMI
IRQ
Bus Timing
E
L
: Level-sensitive IRQ (i = 0 to 5)
j
Figure 20.7 Interrupt Input Timing
i
i
t
t
t
NMIS
NMIS
NMIS
t
t
t
NMIH
NMIH
NMIW
Rev.5.00 Sep. 12, 2007 Page 593 of 764
20. Electrical Characteristics
REJ09B0396-0500