D13007VX13V Renesas Electronics America, D13007VX13V Datasheet - Page 199

MCU 3V 0K 100-TQFP

D13007VX13V

Manufacturer Part Number
D13007VX13V
Description
MCU 3V 0K 100-TQFP
Manufacturer
Renesas Electronics America
Series
H8® H8/300Hr
Datasheets

Specifications of D13007VX13V

Core Processor
H8/300H
Core Size
16-Bit
Speed
13MHz
Connectivity
SCI, SmartCard
Peripherals
DMA, PWM, WDT
Number Of I /o
35
Program Memory Type
ROMless
Ram Size
4K x 8
Voltage - Supply (vcc/vdd)
2.7 V ~ 5.5 V
Data Converters
A/D 8x10b; D/A 2x8b
Oscillator Type
Internal
Operating Temperature
-20°C ~ 75°C
Package / Case
100-TQFP, 100-VQFP
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Eeprom Size
-
Program Memory Size
-
• Immediately after self-refreshing is cleared, external bus release is possible during a given
Refresh
request
RFSH
BACK
Address bus
Similar contention in a transition to self-refresh mode may prevent dependable strobe
waveform output. This can also be avoided by clearing the BRLW bit to 0 in BRCR.
period until the start of a CPU cycle. Attention must be paid to the RAS state to ensure that the
specification for the RAS precharge time immediately after self-refreshing is met.
φ
Strobe
BREQ
BACK
φ
External bus released
Figure 6.34 Bus-Released State and Software Standby Mode
Figure 6.33 Bus-Released State and Refresh Cycles
Refresh cycle
Rev.5.00 Sep. 12, 2007 Page 169 of 764
CPU cycle
Software standby mode
REJ09B0396-0500
6. Bus Controller
Refresh cycle

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