D13007VX13V Renesas Electronics America, D13007VX13V Datasheet - Page 180

• Manufacturer Part Number: D13007VX13V
• Description: MCU 3V 0K 100-TQFP
• Manufacturer: Renesas Electronics America
• Series: H8® H8/300Hr

Specifications of D13007VX13V

• Core Processor: H8/300H
• Core Size: 16-Bit
• Speed: 13MHz
• Connectivity: SCI, SmartCard
• Peripherals: DMA, PWM, WDT
• Number Of I /o: 35
• Program Memory Type: ROMless
• Ram Size: 4K x 8
• Voltage - Supply (vcc/vdd): 2.7 V ~ 5.5 V
• Data Converters: A/D 8x10b; D/A 2x8b
• Oscillator Type: Internal
• Operating Temperature: -20°C ~ 75°C
• Package / Case: 100-TQFP, 100-VQFP
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Eeprom Size: -
• Program Memory Size: -

6. Bus Controller
If a DRAM read/write cycle is followed by an access cycle for an external area other than DRAM
space when HWR and LWR are selected as the UCAS and LCAS output pins, an idle cycle (Ti) is
inserted unconditionally immediately after the DRAM access cycle. See section 6.9, Idle Cycle,
for details.
Rev.5.00 Sep. 12, 2007 Page 150 of 764
REJ09B0396-0500
Read access
Write access
Note: n = 2 to 5
(UCAS / LCAS)
(UCAS / LCAS)
PB4 /PB5
PB4 /PB5
Figure 6.16 Basic Access Timing (CSEL = 0 in DRCRB)
CSn (RAS)
D
D
A
RD(WE)
RD(WE)
23
15
15
φ
to A
to D
to D
AS
0
0
0
T
p
Row
Tr
High
High
T
Column
c1
T
c2