DF2339VFC25V Renesas Electronics America, DF2339VFC25V Datasheet - Page 877

IC H8S/2300 MCU FLASH 144QFP

DF2339VFC25V

Manufacturer Part Number
DF2339VFC25V
Description
IC H8S/2300 MCU FLASH 144QFP
Manufacturer
Renesas Electronics America
Series
H8® H8S/2300r
Datasheets

Specifications of DF2339VFC25V

Core Processor
H8S/2000
Core Size
16-Bit
Speed
25MHz
Connectivity
SCI, SmartCard
Peripherals
DMA, POR, PWM, WDT
Number Of I /o
106
Program Memory Size
384KB (384K x 8)
Program Memory Type
FLASH
Ram Size
32K x 8
Voltage - Supply (vcc/vdd)
3 V ~ 3.6 V
Data Converters
A/D 12x10b; D/A 4x8b
Oscillator Type
Internal
Operating Temperature
-20°C ~ 75°C
Package / Case
144-QFP
For Use With
EDK2329 - DEV EVALUATION KIT H8S/2329
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Eeprom Size
-

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
DF2339VFC25V
Manufacturer:
Renesas Electronics America
Quantity:
10 000
Notes: 1. Except when switching modes, the level of the mode pins (MD2 to MD0) must be fixed until
φ
V
FWE
MD2 to MD0
RES
SWE bit
CC
Period during which flash memory access is prohibited
(x: Wait time after setting SWE bit)
Period during which flash memory can be programmed
(Execution of program in flash memory prohibited, and data reads other than verify operations
prohibited)
2. See section 22.2.6, Flash Memory Characteristics.
3. Mode programming setup time t
power-off by pulling the pins up or down.
*1
Figure 19.57 Power-On/Off Timing (User Program Mode)
t
OSC1
t
MDS
SWE set
*3
*2
Wait time: x
MDS
(min) = 200 ns
Programming/
erasing
possible
Rev.4.00 Sep. 07, 2007 Page 845 of 1210
Wait time: 100 μs
SWE cleared
Min 0 μs
REJ09B0245-0400

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