DF2339VFC25V Renesas Electronics America, DF2339VFC25V Datasheet - Page 1242
![IC H8S/2300 MCU FLASH 144QFP](/photos/12/22/122258/df2339vfc25v_sml.jpg)
DF2339VFC25V
Manufacturer Part Number
DF2339VFC25V
Description
IC H8S/2300 MCU FLASH 144QFP
Manufacturer
Renesas Electronics America
Series
H8® H8S/2300r
Datasheets
1.HEWH8E10A.pdf
(19 pages)
2.D12312SVTE25V.pdf
(341 pages)
3.DF2338VFC25V.pdf
(1246 pages)
Specifications of DF2339VFC25V
Core Processor
H8S/2000
Core Size
16-Bit
Speed
25MHz
Connectivity
SCI, SmartCard
Peripherals
DMA, POR, PWM, WDT
Number Of I /o
106
Program Memory Size
384KB (384K x 8)
Program Memory Type
FLASH
Ram Size
32K x 8
Voltage - Supply (vcc/vdd)
3 V ~ 3.6 V
Data Converters
A/D 12x10b; D/A 4x8b
Oscillator Type
Internal
Operating Temperature
-20°C ~ 75°C
Package / Case
144-QFP
For Use With
EDK2329 - DEV EVALUATION KIT H8S/2329
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Eeprom Size
-
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Company:
Part Number:
DF2339VFC25V
Manufacturer:
Renesas Electronics America
Quantity:
10 000
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The package dimension that is shown in the Renesas Semiconductor Package Data Book has
priority.
Rev.4.00 Sep. 07, 2007 Page 1210 of 1210
REJ09B0245-0400
P-QFP144-20x20-0.50
JEITA Package Code
109
144
e
108
1
PRQP0144KA-A
RENESAS Code
Z
D
Appendix F Package Dimensions
*1
Figure F.1 FP-144G Package Dimensions
H
D
D
y
FP-144G/FP-144GV
*3
b
Previous Code
p
73
36
72
37
x
F
M
MASS[Typ.]
2.4g
Terminal cross section
Detail F
b
b
1
p
L
L
1
NOTE)
1. DIMENSIONS"*1"AND"*2"
2. DIMENSION"*3"DOES NOT
DO NOT INCLUDE MOLD FLASH
INCLUDE TRIM OFFSET.
Reference
Symbol
e
D
E
A
H
H
A
A
b
b
c
c
θ
x
y
Z
Z
L
L
1
p
1
D
E
1
2
1
D
E
Dimension in Millimeters
21.8
21.8 22.0 22.2
0.00
0.17
0.12
Min
0.4
0°
Nom
0.22
0.17
2.70
22.0
0.10
0.20
0.15
1.25
1.25
0.5
0.5
1.0
20
20
22.2
3.05
0.25
0.27
0.22
0.10
0.10
Max
0.6
8°
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