DF2339VFC25V Renesas Electronics America, DF2339VFC25V Datasheet - Page 219

IC H8S/2300 MCU FLASH 144QFP

DF2339VFC25V

Manufacturer Part Number
DF2339VFC25V
Description
IC H8S/2300 MCU FLASH 144QFP
Manufacturer
Renesas Electronics America
Series
H8® H8S/2300r
Datasheets

Specifications of DF2339VFC25V

Core Processor
H8S/2000
Core Size
16-Bit
Speed
25MHz
Connectivity
SCI, SmartCard
Peripherals
DMA, POR, PWM, WDT
Number Of I /o
106
Program Memory Size
384KB (384K x 8)
Program Memory Type
FLASH
Ram Size
32K x 8
Voltage - Supply (vcc/vdd)
3 V ~ 3.6 V
Data Converters
A/D 12x10b; D/A 4x8b
Oscillator Type
Internal
Operating Temperature
-20°C ~ 75°C
Package / Case
144-QFP
For Use With
EDK2329 - DEV EVALUATION KIT H8S/2329
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Eeprom Size
-

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
DF2339VFC25V
Manufacturer:
Renesas Electronics America
Quantity:
10 000
6.7.3
As with the basic bus interface, either program wait insertion or pin wait insertion using the WAIT
pin can be used in the initial cycle (full access) on the burst ROM interface. See section 6.4.5,
Wait Control.
Wait states cannot be inserted in a burst cycle.
Figure 6.30 (b) Example of Burst ROM Access Timing (When AST0 = BRSTS1 = 0)
Wait Control
Address
bus
CS
AS
RD
Data bus
φ
0
T
Full access
1
Read data
T
2
Read data Read data
Rev.4.00 Sep. 07, 2007 Page 187 of 1210
Only lower address
T
Burst access
1
changed
T
1
REJ09B0245-0400

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