DF2339VFC25V Renesas Electronics America, DF2339VFC25V Datasheet - Page 199

IC H8S/2300 MCU FLASH 144QFP

DF2339VFC25V

Manufacturer Part Number
DF2339VFC25V
Description
IC H8S/2300 MCU FLASH 144QFP
Manufacturer
Renesas Electronics America
Series
H8® H8S/2300r
Datasheets

Specifications of DF2339VFC25V

Core Processor
H8S/2000
Core Size
16-Bit
Speed
25MHz
Connectivity
SCI, SmartCard
Peripherals
DMA, POR, PWM, WDT
Number Of I /o
106
Program Memory Size
384KB (384K x 8)
Program Memory Type
FLASH
Ram Size
32K x 8
Voltage - Supply (vcc/vdd)
3 V ~ 3.6 V
Data Converters
A/D 12x10b; D/A 4x8b
Oscillator Type
Internal
Operating Temperature
-20°C ~ 75°C
Package / Case
144-QFP
For Use With
EDK2329 - DEV EVALUATION KIT H8S/2329
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Eeprom Size
-

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
DF2339VFC25V
Manufacturer:
Renesas Electronics America
Quantity:
10 000
6.5
6.5.1
When the chip is in advanced mode, external space areas 2 to 5 can be designated as DRAM
space, and DRAM interfacing performed. With the DRAM interface, DRAM can be directly
connected to the chip. A DRAM space of 2, 4, or 8 Mbytes can be set by means of bits RMTS2 to
RMTS0 in BCRH. Burst operation is also possible, using fast page mode.
6.5.2
Areas 2 to 5 are designated as DRAM space by setting bits RMTS2 to RMTS0 in BCRH. The
relation between the settings of bits RMTS2 to RMTS0 and DRAM space is shown in table 6.4.
Possible DRAM space settings are: one area (area 2), two areas (areas 2 and 3), and four areas
(areas 2 to 5).
Table 6.4
RMTS2
0
DRAM Interface
Overview
Setting DRAM Space
RMTS1
0
1
DRAM Space Settings by Bits RMTS2 to RMTS0
RMTS0
1
0
1
Area 5
Normal space
Normal space
DRAM space
Area 4
Normal space
Normal space
DRAM space
Rev.4.00 Sep. 07, 2007 Page 167 of 1210
Area 3
Normal space
DRAM space
DRAM space
REJ09B0245-0400
Area 2
DRAM space
DRAM space
DRAM space

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