DF2339VFC25V Renesas Electronics America, DF2339VFC25V Datasheet - Page 200

IC H8S/2300 MCU FLASH 144QFP

DF2339VFC25V

Manufacturer Part Number
DF2339VFC25V
Description
IC H8S/2300 MCU FLASH 144QFP
Manufacturer
Renesas Electronics America
Series
H8® H8S/2300r
Datasheets

Specifications of DF2339VFC25V

Core Processor
H8S/2000
Core Size
16-Bit
Speed
25MHz
Connectivity
SCI, SmartCard
Peripherals
DMA, POR, PWM, WDT
Number Of I /o
106
Program Memory Size
384KB (384K x 8)
Program Memory Type
FLASH
Ram Size
32K x 8
Voltage - Supply (vcc/vdd)
3 V ~ 3.6 V
Data Converters
A/D 12x10b; D/A 4x8b
Oscillator Type
Internal
Operating Temperature
-20°C ~ 75°C
Package / Case
144-QFP
For Use With
EDK2329 - DEV EVALUATION KIT H8S/2329
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Eeprom Size
-

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
DF2339VFC25V
Manufacturer:
Renesas Electronics America
Quantity:
10 000
6.5.3
With DRAM space, the row address and column address are multiplexed. In address multiplexing,
the size of the shift of the row address is selected with bits MXC1 and MXC0 in MCR. Table 6.5
shows the relation between the settings of MXC1 and MXC0 and the shift size.
Table 6.5
Row
address
Column
address
Rev.4.00 Sep. 07, 2007 Page 168 of 1210
REJ09B0245-0400
MXC1 MXC0
0
1
Address Multiplexing
Address Multiplexing Settings by Bits MXC1 and MXC0
MCR
0
1
0
1
Shift
Size
8 bits
9 bits
10 bits
Setting
pro-
hibited
A
to
A
A
to
A
A
to
A
A
to
A
A
to
A
23
13
23
13
23
13
23
13
23
13
A
A
A
A
A
20
12
12
12
12
A
A
A
A
A
11
19
20
11
11
A
A
A
A
A
18
19
20
10
10
A
A
A
A
A
9
17
18
19
9
A
A
A
A
A
16
17
18
8
8
Address Pins
A
A
A
A
A
15
16
17
7
7
A
A
A
A
A
6
14
15
16
6
A
A
A
A
A
13
14
15
5
5
A
A
A
A
A
4
12
13
14
4
A
A
A
A
A
11
12
13
3
3
A
A
A
A
A
10
11
12
2
2
A
A
A
A
A
1
9
10
11
1
A
A
A
A
A
8
9
10
0
0

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