AT91RM9200-CI-002 Atmel, AT91RM9200-CI-002 Datasheet - Page 662

• Manufacturer Part Number: AT91RM9200-CI-002
• Description: IC ARM9 MCU 256 BGA
• Manufacturer: Atmel
• Series: AT91SAMr

Specifications of AT91RM9200-CI-002

• Core Processor: ARM9
• Core Size: 16/32-Bit
• Speed: 180MHz
• Connectivity: EBI/EMI, Ethernet, I²C, MMC, SPI, SSC, UART/USART, USB
• Peripherals: POR
• Number Of I /o: 122
• Program Memory Size: 128KB (128K x 8)
• Program Memory Type: ROM
• Ram Size: 48K x 8
• Voltage - Supply (vcc/vdd): 1.65 V ~ 1.95 V
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 85°C
• Package / Case: 256-BGA
• Lead Free Status / RoHS Status: Contains lead / RoHS non-compliant
• Eeprom Size: -
• Data Converters: -

39.1.3
39.2
Figure 39-1. 208-pin PQFP Package Drawing
662
Package Drawings
AT91RM9200
Junction Temperature
The average chip-junction temperature, T
where:
From the first equation, the user can derive the estimated lifetime of the chip and decide if a
cooling device is necessary or not. If a cooling device is to be fitted on the chip, the second
equation should be used to compute the resulting average chip-junction temperature T
1.
2.
• θ
• θ
• θ
• P
• T
C
page
Table 39-1 on page
Consumption” on page
JA
JC
HEAT SINK
A
D
T
T
= ambient temperature (°C).
= device power consumption (W) estimated from data provided in the section
= package thermal resistance, Junction-to-ambient (°C/W), provided in
= package thermal resistance, Junction-to-case thermal resistance (°C/W), provided in
J
J
=
661.
=
T
T
A
A
= cooling device thermal resistance (°C/W), provided in the device datasheet.
+
+
C1
P (
(
P
D
D
×
×
θ (
θ
HEATSINK
661.
JA
)
634.
+
θ
JC
) )
J
, in °C can be obtained from the following:
1768I–ATARM–09-Jul-09
Table 39-1 on
37.5 “Power
J
in °C.