DF70845AD80FPV Renesas Electronics America, DF70845AD80FPV Datasheet - Page 382
DF70845AD80FPV
Manufacturer Part Number
DF70845AD80FPV
Description
IC SUPERH MCU FLASH 112LQFP
Manufacturer
Renesas Electronics America
Series
SuperH® SH7080r
Datasheet
1.DF70844AD80FPV.pdf
(1644 pages)
Specifications of DF70845AD80FPV
Core Size
32-Bit
Program Memory Size
512KB (512K x 8)
Core Processor
SH-2
Speed
80MHz
Connectivity
EBI/EMI, FIFO, I²C, SCI, SSU
Peripherals
DMA, POR, PWM, WDT
Number Of I /o
76
Program Memory Type
FLASH
Ram Size
32K x 8
Voltage - Supply (vcc/vdd)
3 V ~ 5.5 V
Data Converters
A/D 8x10b
Oscillator Type
Internal
Operating Temperature
-40°C ~ 85°C
Package / Case
112-LQFP
No. Of I/o's
76
Ram Memory Size
32KB
Cpu Speed
80MHz
Digital Ic Case Style
LQFP
Supply Voltage Range
3V To 3.6V, 4.5V To 5.5V
Embedded Interface Type
I2C, SCI
Rohs Compliant
Yes
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
For Use With
R0K570865S001BE - KIT STARTER FOR SH7086R0K570865S000BE - KIT STARTER FOR SH7086HS0005KCU11H - EMULATOR E10A-USB H8S(X),SH2(A)
Eeprom Size
-
Lead Free Status / RoHS Status
Lead free / RoHS Compliant, Lead free / RoHS Compliant
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Company:
Part Number:
DF70845AD80FPV
Manufacturer:
TAIYO
Quantity:
40 000
Company:
Part Number:
DF70845AD80FPV
Manufacturer:
Renesas Electronics America
Quantity:
10 000
- Current page: 382 of 1644
- Download datasheet (10Mb)
Section 9 Bus State Controller (BSC)
the access is performed by issuing an ACTV command followed by a READ or WRIT command.
If this is followed by an access to a different row address, the access time will be longer because
of the precharging performed after the access request is issued. The number of cycles between
issuance of the PRE command and the ACTV command is determined by the WTRP1 and
WTRP0 bits in CS3WCR.
In a write, when an auto-precharge is performed, a command cannot be issued to the same bank
for a period of Trwl + Tap cycles after issuance of the WRITA command. When bank active mode
is used, READ or WRIT commands can be issued successively if the row address is the same. The
number of cycles can thus be reduced by Trwl + Tap cycles for each write.
There is a limit on tRAS, the time for placing each bank in the active state. If there is no guarantee
that another row address will be accessed within the period in which this value is maintained by
program execution, it is necessary to set the refresh cycle to no more than the value of tRAS.
A burst read cycle without auto-precharge is shown in figure 9.22, a burst read cycle for the same
row address in figure 9.23, and a burst read cycle for different row addresses in figure 9.24.
Similarly, a single write cycle without auto-precharge is shown in figure 9.25, a single write cycle
for the same row address in figure 9.26, and a single write cycle for different row addresses in
figure 9.27.
In figure 9.23, a Tnop cycle in which no operation is performed is inserted before the Tc cycle that
issues the READ command. The Tnop cycle is inserted to acquire two cycles of CAS latency for
the DQMxx signal that specifies the read byte in the data read from the SDRAM. If the CAS
latency is specified as two cycles or more, the Tnop cycle is not inserted because the two cycles of
latency can be acquired even if the DQMxx signal is asserted after the Tc cycle.
When bank active mode is set, if only accesses to the respective banks in area 3 are considered, as
long as accesses to the same row address continue, the operation starts with the cycle in figure
9.22 or 9.25, followed by repetition of the cycle in figure 9.23 or 9.26. An access to a different
area or bank during this time has no effect. If there is an access to a different row address in the
bank active state, after this is detected the bus cycle in figure 9.23 or 9.26 is executed instead of
that in figure 9.24 or 9.27. In bank active mode, too, all banks become inactive after a refresh
cycle or after the bus is released as the result of bus arbitration.
Rev. 3.00 May 17, 2007 Page 324 of 1582
REJ09B0181-0300
Related parts for DF70845AD80FPV
Image
Part Number
Description
Manufacturer
Datasheet
Request
R
Part Number:
Description:
KIT STARTER FOR M16C/29
Manufacturer:
Renesas Electronics America
Datasheet:
Part Number:
Description:
KIT STARTER FOR R8C/2D
Manufacturer:
Renesas Electronics America
Datasheet:
Part Number:
Description:
R0K33062P STARTER KIT
Manufacturer:
Renesas Electronics America
Datasheet:
Part Number:
Description:
KIT STARTER FOR R8C/23 E8A
Manufacturer:
Renesas Electronics America
Datasheet:
Part Number:
Description:
KIT STARTER FOR R8C/25
Manufacturer:
Renesas Electronics America
Datasheet:
Part Number:
Description:
KIT STARTER H8S2456 SHARPE DSPLY
Manufacturer:
Renesas Electronics America
Datasheet:
Part Number:
Description:
KIT STARTER FOR R8C38C
Manufacturer:
Renesas Electronics America
Datasheet:
Part Number:
Description:
KIT STARTER FOR R8C35C
Manufacturer:
Renesas Electronics America
Datasheet:
Part Number:
Description:
KIT STARTER FOR R8CL3AC+LCD APPS
Manufacturer:
Renesas Electronics America
Datasheet:
Part Number:
Description:
KIT STARTER FOR RX610
Manufacturer:
Renesas Electronics America
Datasheet:
Part Number:
Description:
KIT STARTER FOR R32C/118
Manufacturer:
Renesas Electronics America
Datasheet:
Part Number:
Description:
KIT DEV RSK-R8C/26-29
Manufacturer:
Renesas Electronics America
Datasheet:
Part Number:
Description:
KIT STARTER FOR SH7124
Manufacturer:
Renesas Electronics America
Datasheet:
Part Number:
Description:
KIT STARTER FOR H8SX/1622
Manufacturer:
Renesas Electronics America
Datasheet:
Part Number:
Description:
KIT DEV FOR SH7203
Manufacturer:
Renesas Electronics America
Datasheet: