st72324bk STMicroelectronics, st72324bk Datasheet - Page 152

• Manufacturer Part Number: st72324bk
• Description: 3 V/5 V Range 8-bit Mcu With 4/8 Kbyte Rom, 10-bit Adc, Four Timers And Spi
• Manufacturer: STMicroelectronics

Package characteristics
12.2
12.3
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Thermal characteristics
Table 91.
1. The maximum power dissipation is obtained from the formula P
2. The maximum chip-junction temperature is based on technology characteristics.
Soldering information
In order to meet environmental requirements, ST offers these devices in ECOPACK®
packages. These packages have a lead-free second level interconnect. The category of
second-level interconnect is marked on the package and on the inner box label, in
compliance with JEDEC Standard JESD97. The maximum ratings related to soldering
conditions are also marked on the inner box label.
Symbol
T
R
of an application can be defined by the user with the formula: P
internal power (I
application.
Jmax
P
thJA
D
Package thermal resistance (junction to
ambient)
Power dissipation
Maximum junction temperature
Package thermal characteristics
DD
x V
DD
) and P
(1)
PORT
is the port power dissipation depending on the ports used in the
Ratings
(2)
LQFP48 7x7
LQFP44 10x10
LQFP32 7x7
SDIP32 200 mil
D
D
= P
= (T
INT
J
-T
+ P
A
) / R
PORT
thJA
where P
. The power dissipation
ST72323 ST72323L
Value
INT
500
150
80
52
70
50
is the chip
°C/W
Unit
mW
°C