cx28560 Mindspeed Technologies, cx28560 Datasheet - Page 198

• Manufacturer Part Number: cx28560
• Description: Hdlc Controller
• Manufacturer: Mindspeed Technologies

Electrical and Mechanical Specification
8.4
Figure 8-17. Package Diagram
8-22
4.
5.
6.
10.
11.
12.
NOTE(S):
1.
2.
3.
7.
8.
9.
13. Dimensioning and tolerancing per ASME Y14.5M 1994.
All dimensions are in millimeters.
"e" represents the basic solder ball grid pitch.
"M" represents the basic solder ball matrix size. and symbol "N" is the maximum
allowable number of balls after depopulating.
"b" is measured at the maximum solder ball diameter after reflow parallel to primary
Datum
Dimension "aaa" ismeasured parallel to primary Datum
Primary Datum
solder balls.
Package surface shall be black oxide.
Cavity depth C1 various with die thickness.
substrate material base is copper.
Bilateral tolerance zone is applied to each side of package body.
45 Deg. 0.35 mm chamfer coner and white dot for PIN 1 identification.
Heatspreader thickness dimension is set by die thickness.
0.35 mm Chamfer)
(4 Pls, 45˚
– C –
Detail B
Corner
11
.
– C –
Mechanical Specification
g
and Seating Plane are defined by the sherical crowns of the
TOP VIEW
g
4
D
b
00.30
00.30
Mindspeed Technologies™
M
M
C
C
– C –
P
Advance Information
A
– A –
M B M
.
E
0.10
– B –
Detail B
Detail A
E1
10
REF.
A
A1
D
D1
E
E1
b
c
M
N
aaa
ccc
e
P
g
e
39
38
37
36
35
Dimensional References
MIN.
1.20
0.40
39.8
39.8
0.05
0.80
0.15
0.35
34
33
5
32
31
BOTTOM VIEW
30
29
28
SIDE VIEW
27
26
25
38.0 BSC.
38.0 BSC.
1.00 TYP.
24
23
aaa C
NOM.
0.625
22
1.40
0.50
0.90
21
680
Detail A
D1
40
40
39
20
c
19
18
A1
17
16
15
14
e
13
12
11
10
A
9
MAX.
8
1.60
0.60
40.2
40.2
0.75
1.00
0.15
0.15
7
6
– C –
5
4
CX28560 Data Sheet
6
3
2
28560-DSH-001-B
1
ccc C
A
C
E
G
J
L
N
R
U
W
AA
AC
AE
AG
AJ
AL
AN
AR
AU
AW
101302_028
B
D
F
H
K
M
P
T
V
Y
AB
AD
AF
AH
AK
AM
AP
AT
AV