adsp-bf548 Analog Devices, Inc., adsp-bf548 Datasheet - Page 86

• Manufacturer Part Number: adsp-bf548
• Description: Blackfin Embedded Processor
• Manufacturer: Analog Devices, Inc.

ADSP-BF542/ADSP-BF544/ADSP-BF547/ADSP-BF548/ADSP-BF549
OUTLINE DIMENSIONS
Dimensions for the 17 mm × 17 mm CSP_BGA package in
Figure 64
SURFACE-MOUNT DESIGN
Table 55
standard design recommendations, refer to IPC-7351, Generic
Requirements for Surface-Mount Design and Land Pattern
Standard.
Table 55. BGA Data for Use with Surface-mount Design
Package
400-Ball CSP_BGA (Chip Scale Package Ball Grid Array) BC-400-1 Solder Mask Defined
1.70 MAX
is provided as an aid to PCB design. For industry-
are shown in millimeters.
NOTES:
1. ALL DIMENSIONS ARE IN MILLIMETERS.
2. COMPLIANT TO JEDEC REGISTERED OUTLINE MO-205, VARIATION AM,
3. CENTER DIMENSIONS ARE NOMINAL.
WITH THE EXCEPTION OF BALL DIAMETER.
A1 BALL INDICATOR
Figure 64. 400-Ball, 17 mm
SIDE VIEW
17.00 BSC SQ
TOP VIEW
DETAIL A
Rev. A | Page 86 of 88 | October 2008
×
17 mm CSP_BGA (Chip Scale Package Ball Grid Array) (BC-400-1)
Ball Attach Type
BALL DIAMETER
M
W
A
B
C
D
E
G
H
K
N
P
R
U
V
Y
F
J
L
T
0.12 MAX
COPLANARITY
20 19 18 17
0.50
0.45
0.40
0.80 BSC BALL PITCH
16
15 14 13 12 11 10 9 8 7 6 5 4 3 2 1
Solder Mask Opening
0.40 mm Diameter
15.20 BSC SQ
BOTTOM VIEW
DETAIL A
SEATING PLANE
0.28 MIN
Ball Pad Size
0.50 mm Diameter
A1 BALL