adsp-bf548 Analog Devices, Inc., adsp-bf548 Datasheet - Page 78

• Manufacturer Part Number: adsp-bf548
• Description: Blackfin Embedded Processor
• Manufacturer: Analog Devices, Inc.

ADSP-BF542/ADSP-BF544/ADSP-BF547/ADSP-BF548/ADSP-BF549
THERMAL CHARACTERISTICS
To determine the junction temperature on the application
printed circuit board use
where:
T
T
ter of package.
Ψ
P
calculate P
Values of θ
circuit board design considerations. θ
order approximation of T
where:
T
Values of θ
circuit board design considerations when an external heatsink is
required.
Values of θ
circuit board design considerations.
In
dards JESD51-2 and JESD51-6, and the junction-to-board
measurement complies with JESD51-8. The junction-to-case
measurement complies with MIL-STD-883 (Method 1012.1).
All measurements use a 2S2P JEDEC test board.
Table 52. Thermal Characteristics, 400-Ball CSP_BGA
Parameter
θ
θ
θ
Ψ
D
J
CASE
A
JT
JA
JB
JC
=junction temperature ( C)
JT
Table
= power dissipation (see
= ambient temperature ( C)
= from
= case temperature ( C) measured by customer at top cen-
52, airflow measurements comply with JEDEC stan-
D
JA
JC
JB
Table 50
are provided for package comparison and printed
are provided for package comparison and printed
are provided for package comparison and printed
Condition
0 linear m/s air flow
1 linear m/s air flow
2 linear m/s air flow
0 linear m/s air flow
1 linear m/s air flow
2 linear m/s air flow
T
J
T J
=
=
T
CASE
J
T A
by the equation
Table 16 on Page 37
+
+
(
θ JA
(
Ψ
JT
JA
×
P D
can be used for a first
×
P
)
D
)
Typical
18.4
15.8
15.0
9.75
6.37
0.27
0.60
0.66
for a method to
Rev. A | Page 78 of 88 | October 2008
Unit
C/W
C/W
C/W
C/W
C/W
C/W
C/W
C/W