MPC564EVB Freescale Semiconductor, MPC564EVB Datasheet - Page 1219

• Manufacturer Part Number: MPC564EVB
• Description: KIT EVAL FOR MPC561/562/563/564
• Manufacturer: Freescale Semiconductor
• Type: Microcontrollerr

Specifications of MPC564EVB

• Contents: Module Board, Installation Guide, Power Supply, Cable, Software and more
• Processor To Be Evaluated: MPC56x
• Data Bus Width: 32 bit
• Interface Type: RS-232, Ethernet
• For Use With/related Products: MPC561, 562, 563, 564
• Lead Free Status / RoHS Status: Contains lead / RoHS non-compliant

F.2.2
EMC – Electromagnetic Compatibility
EMI – Electromagnetic Interference
TEM cell – Transverse Electromagnetic Mode cell
F.2.3
F.3
Freescale Semiconductor
1. Scan range: 150 KHz – 1000 MHz
2. Operating Frequency: 56 MHz
3. Operating Voltages: 2.6 V, 5.0 V
4. Max spikes: TBD dBuV
5. I/O port waveforms: Per J1752/3
6. Temperature: 25 °C
1
2
3
4
5
6
7
8
BGA Package Thermal Resistance,
Junction to Ambient – Natural Convection
BGA Package Thermal Resistance,
Junction to Ambient – Four layer (2s2p) board, natural
convection
BGA Package Thermal Resistance,
Junction to Board
BGA Package Thermal Resistance,
Junction to Case (top)
BGA Package Thermal Resistance,
Junction to Package Top, Natural Convection
Junction temperature is a function of on-chip power dissipation, package thermal resistance, mounting site
(board) temperature, ambient temperature, air flow, power dissipation of other components on the board, and
the board thermal resistance.
Per SEMI G38-87 and JESD51-2 with the board horizontal.
These values are the mean + 3 standard deviations of characterized data.
Junction temperature is a function of on-chip power dissipation, package thermal resistance, mounting site
(board) temperature, ambient temperature, air flow, power dissipation of other components on the board, and
the board thermal resistance.
Per JESD51-6 with the board horizontal.
Thermal resistance between the die and the printed circuit board (Four layer (2s2p) board, natural convection).
Indicates the thermal resistance between the die and the case top surface as measured by the cold plate
method (MIL SPEC-883 Method 1012.1) with the cold plate temperature used for the case
temperature.
Thermal characterization parameter indicating the temperature difference between package top and the
junction temperature per EIA/JESD51-2.
Thermal Characteristics
Definitions and Acronyms
EMI Testing Specifications
Characteristic
MPC561/MPC563 Reference Manual, Rev. 1.2
Table F-2. Thermal Characteristics
Symbol
R
R
R
R
Ψ
θJMA
θJA
θJB
θJT
JT
47.3
29.4
21.2
Value
7.0
1.6
1,2,3
3,4
3,7
8
3,6
,
5
Electrical Characteristics
°C/W
°C/W
°C/W
°C/W
°C/W
Unit
F-3