LFXP3C-3TN100I Lattice, LFXP3C-3TN100I Datasheet - Page 356

• Manufacturer Part Number: LFXP3C-3TN100I
• Description: FPGA - Field Programmable Gate Array 3.1K LUTs 62 IO 1.8/ 2.5/3.3V -3 Spd I
• Manufacturer: Lattice

Specifications of LFXP3C-3TN100I

• Number Of Programmable I/os: 62
• Data Ram Size: 55296
• Supply Voltage (max): 3.465 V
• Maximum Operating Temperature: + 100 C
• Minimum Operating Temperature: - 40 C
• Mounting Style: SMD/SMT
• Supply Voltage (min): 1.71 V
• Package / Case: TQFP-100
• Package: 100TQFP
• Family Name: LatticeXP
• Device Logic Units: 3000
• Maximum Internal Frequency: 320 MHz
• Typical Operating Supply Voltage: 1.8|2.5|3.3 V
• Maximum Number Of User I/os: 62
• Ram Bits: 55296
• Re-programmability Support: Yes
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant

Lattice Semiconductor
example, the NCD file with the best timing score would be saved. The tool keeps track of the timing and routing per-
formance for every iteration in a file called the multiple par report (.par). Such a file is shown in Figure 17-10.
Figure 17-10. Multiple PAR Report (.par)
Figure 17-10 indicates that:
Note that, in Figure 17-8, if “Placement Iterations (0=run until solved)” is set to 0, the tool will run indefinitely
through multiple iterations until a 0 timing score is reached. In a design that is known to have large timing violations,
a 0 timing score will never be reached. As a consequence, the user must intervene and stop the flow at a given
point in time.
In general, multiple placement iterations can help placement but can also use many CPU cycles. Multiple place-
ment iterations should be used carefully due to system limitations and the uncertainty of results. It is better to fix the
root cause of timing problems in the design stage.
Clock Boosting
Clock boosting, supported in Lattice Semiconductor’s ORCA Series device family, is the deliberate introduction of
clock skew on a target flop to increase the setup margin. Every programmable flip-flop in the device has program-
mable delay elements before clock inputs for this purpose. The automated clock boosting tool will attempt to meet
setup constraints by introducing delays to as many target registers as needed to meet timing, in effect, borrow reg-
ister hold margins to meet register set-up timing. The following bullets summarize how clock boosting is accom-
plished in Lattice Semiconductor ORCA Series device family.
• The “5_” under the Level/Cost column means that the Placement Effort level was set to 5. The Placement
• 10 different iterations ran (10 cost tables).
• Timing scores are expressed in total picoseconds (ps) by which the design is missing constraints on all
• Iteration number 4 (cost table 4) achieved a 0 timing score and hence was the design saved. More than one
• Each iteration routed completely.
• A 4-tap delay cell structure in front of the clock port of every flip-flop in the device (includes I/O flip-flops)
• Ability to borrow clock cycle time from one easily-met path and give this time to a difficult-to-meet path
Effort level can range from 1 (lowest) to 5 (highest).
preferences.
.ncd file can be saved. This is user-controlled via the “Placement Save Best Runs” value box shown in
Figure 17-8.
Level/
Cost [ncd]
----------
5_4
5_6
5_2
5_7
5_3
5_10
5_1
5_8
5_5
5_9
* : Design saved.
*
Number
Unrouted
--------
0
0
0
0
0
0
0
0
0
0
Timing
Score
-------
0
25
102
158
186
318
470
562
732
844
17-12
Run
Time
-----
01:58
02:01
01:45
02:15
01:54
02:39
01:51
02:25
02:00
02:27
Lattice Semiconductor FPGA
Successful Place and Route
NCD
Status
--------
Complete
Complete
Complete
Complete
Complete
Complete
Complete
Complete
Complete
Complete