LFXP3C-3TN100I Lattice, LFXP3C-3TN100I Datasheet - Page 238

• Manufacturer Part Number: LFXP3C-3TN100I
• Description: FPGA - Field Programmable Gate Array 3.1K LUTs 62 IO 1.8/ 2.5/3.3V -3 Spd I
• Manufacturer: Lattice

Specifications of LFXP3C-3TN100I

• Number Of Programmable I/os: 62
• Data Ram Size: 55296
• Supply Voltage (max): 3.465 V
• Maximum Operating Temperature: + 100 C
• Minimum Operating Temperature: - 40 C
• Mounting Style: SMD/SMT
• Supply Voltage (min): 1.71 V
• Package / Case: TQFP-100
• Package: 100TQFP
• Family Name: LatticeXP
• Device Logic Units: 3000
• Maximum Internal Frequency: 320 MHz
• Typical Operating Supply Voltage: 1.8|2.5|3.3 V
• Maximum Number Of User I/os: 62
• Ram Bits: 55296
• Re-programmability Support: Yes
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant

Lattice Semiconductor
Appendix A. Using IPexpress™ to Generate DDR Modules
The input and output DDR module can be generated using IPexpress. The I/O section under the Architecture mod-
ules provides two options to the user:
IPexpress generates only the modules that are implemented within the IOLOGIC. Any logic required in the FPGA
core to complete the memory interface must be implemented by the user.
Figure 10-18. IPexpress I/O Section
DDR Generic
DDR Generic will generate the output DDR (ODDRXB) primitives for a given bus width. The user has the option to
enable or disable tristate control to the output DDR registers. Figure 10-19 shows the DDR Generic views of IPex-
press.
1. DDR_GENERIC – The option allows generation of a Generic DDR interface, which in the case of Lat-
2. DDR_MEM – This option allows the user to generate a complete DDR memory interface. It will generate
ticeECP/EC and LatticeXP devices, is only the output side DDR. The input side for a Generic DDR inter-
face must be implemented using PFU registers. Appendix D provides the example code for the input side
generic DDR.
both the read and write side interface required to interface with the memory.
10-19
LatticeECP/EC and LatticeXP
DDR Usage Guide