EFM32TG210F32 Energy Micro, EFM32TG210F32 Datasheet - Page 410
EFM32TG210F32
Manufacturer Part Number
EFM32TG210F32
Description
MCU 32BIT 32KB FLASH 32-QFN
Manufacturer
Energy Micro
Series
Tiny Geckor
Specifications of EFM32TG210F32
Core Processor
ARM® Cortex-M3™
Core Size
32-Bit
Speed
32MHz
Connectivity
EBI/EMI, I²C, IrDA, SmartCard, SPI, UART/USART
Peripherals
Brown-out Detect/Reset, DMA, POR, PWM, WDT
Number Of I /o
24
Program Memory Size
32KB (32K x 8)
Program Memory Type
FLASH
Ram Size
4K x 8
Voltage - Supply (vcc/vdd)
1.8 V ~ 3.8 V
Data Converters
A/D 4x12b, D/A 1x12b
Oscillator Type
External
Operating Temperature
-40°C ~ 85°C
Package / Case
32-VQFN Exposed Pad
Processor Series
EFM32
Core
ARM Cortex-M3
Data Bus Width
32 bit
Data Ram Size
32 KB
Interface Type
UART, I2C, SPI
Maximum Clock Frequency
32 MHz
Number Of Programmable I/os
17
Number Of Timers
1
Operating Supply Voltage
1.8 V to 3.8 V
Maximum Operating Temperature
+ 85 C
Mounting Style
SMD/SMT
Processor To Be Evaluated
EFM32TG210
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Eeprom Size
-
Lead Free Status / Rohs Status
Details
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reference and when the reference is changed, the gain must be re-calibrated. Gain and offset for the
1V25, 2V5 and VDD references are calibrated during production and the calibration values for these
can be found in the Device Information page. During reset, the gain and offset calibration registers are
loaded with the production calibration values for the 1V25 reference.
25.3.10 Opamps
The DAC includes a set of three highly configurable opamps that can be accesssed in the DAC module.
Two of the opamps are located in the DAC, while the third opamp is a standalone opamp. For detailed
description see the OPAMP chapter. The register description can be found Section 25.5 (p. 411)
www.energymicro.com
2010-12-21 - d0034_Rev0.90
410
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