HD64F2676VFC33 Renesas Electronics America, HD64F2676VFC33 Datasheet - Page 938

• Manufacturer Part Number: HD64F2676VFC33
• Description: IC H8S MCU FLASH 256K 144-QFP
• Manufacturer: Renesas Electronics America
• Series: H8® H8S/2600r

Specifications of HD64F2676VFC33

• Core Processor: H8S/2600
• Core Size: 16-Bit
• Speed: 33MHz
• Connectivity: IrDA, SCI
• Peripherals: DMA, POR, PWM, WDT
• Number Of I /o: 103
• Program Memory Size: 256KB (256K x 8)
• Program Memory Type: FLASH
• Ram Size: 8K x 8
• Voltage - Supply (vcc/vdd): 3 V ~ 3.6 V
• Data Converters: A/D 12x10b; D/A 4x8b
• Oscillator Type: Internal
• Operating Temperature: -20°C ~ 75°C
• Package / Case: 144-QFP
• Lead Free Status / RoHS Status: Contains lead / RoHS non-compliant
• Eeprom Size: -

Section 24 Electrical Characteristics
Rev. 3.00 Mar 17, 2006 page 886 of 926
REJ09B0283-0300
Read
Write
EDACK0 to EDACK3
Notes: DACK and EDACK timing: when DDS = 0 and EDDS = 0
DACK0, DACK1
A23 to A0
RAS5 to RAS2
UCAS
LCAS
OE, RD
HWR
D15 to D0
OE, RD
HWR
D15 to D0
AS
RAS timing: when RAST = 0
Figure 24.14 DRAM Access Timing: Two-State Access
t
AD
Tp
t
t
AS3
PCH2
Tr
t
CSD2
t
t
t
DACD1
EDACD1
AH1
t
t
AD
t
WRD2
WDD
Tc1
t
t
AS2
AC4
t
t
OED1
WDS1
t
WCS1
t
AA3
t
t
WCH1
CASD1
t
AC1
Tc2
t
WDH2
t
CASW1
t
AH2
t
RDS2
t
WRD2
t
RDH2
t
OED1
t
t
t
DACD2
EDACD2
CASD1
t
CSD3