HD64F2676VFC33 Renesas Electronics America, HD64F2676VFC33 Datasheet - Page 247

• Manufacturer Part Number: HD64F2676VFC33
• Description: IC H8S MCU FLASH 256K 144-QFP
• Manufacturer: Renesas Electronics America
• Series: H8® H8S/2600r

Specifications of HD64F2676VFC33

• Core Processor: H8S/2600
• Core Size: 16-Bit
• Speed: 33MHz
• Connectivity: IrDA, SCI
• Peripherals: DMA, POR, PWM, WDT
• Number Of I /o: 103
• Program Memory Size: 256KB (256K x 8)
• Program Memory Type: FLASH
• Ram Size: 8K x 8
• Voltage - Supply (vcc/vdd): 3 V ~ 3.6 V
• Data Converters: A/D 12x10b; D/A 4x8b
• Oscillator Type: Internal
• Operating Temperature: -20°C ~ 75°C
• Package / Case: 144-QFP
• Lead Free Status / RoHS Status: Contains lead / RoHS non-compliant
• Eeprom Size: -

Refreshing and All-Module-Clocks-Stopped Mode: In this LSI, if the ACSE bit is set to 1 in
MSTPCRH, and then a SLEEP instruction is executed with the setting for all peripheral module
clocks to be stopped (MSTPCR = H'FFFF) or for operation of the 8-bit timer module alone
(MSTPCR = H'FFFE), and a transition is made to the sleep state, the all-module-clocks-stopped
mode is entered, in which the bus controller and I/O port clocks are also stopped. As the bus
controller clock is also stopped in this mode, CBR refreshing is not executed. If DRAM is
connected externally and DRAM data is to be retained in sleep mode, the ACSE bit must be
cleared to 0 in MSTPCRH.
6.6.13
When burst mode is selected on the DRAM interface, the DACK and EDACK output timing can
be selected with the DDS and EDDS bits in DRAMCR. When DRAM space is accessed in DMAC
Address bus
RASn (CSn)
UCAS, LCAS
OE (RD)
WR (HWR)
Data bus
Note: n = 2 to 5
Figure 6.40 Example of Timing when Precharge Time after Self-Refreshing Is Extended
DMAC and EXDMAC Single Address Transfer Mode and DRAM Interface
Software
standby
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rc3
by 2 States
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rp2
Rev. 3.00 Mar 17, 2006 page 195 of 926
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Section 6 Bus Controller (BSC)
DRAM space write
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REJ09B0283-0300
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