HD64F2676VFC33 Renesas Electronics America, HD64F2676VFC33 Datasheet - Page 294

IC H8S MCU FLASH 256K 144-QFP

HD64F2676VFC33

Manufacturer Part Number
HD64F2676VFC33
Description
IC H8S MCU FLASH 256K 144-QFP
Manufacturer
Renesas Electronics America
Series
H8® H8S/2600r
Datasheets

Specifications of HD64F2676VFC33

Core Processor
H8S/2600
Core Size
16-Bit
Speed
33MHz
Connectivity
IrDA, SCI
Peripherals
DMA, POR, PWM, WDT
Number Of I /o
103
Program Memory Size
256KB (256K x 8)
Program Memory Type
FLASH
Ram Size
8K x 8
Voltage - Supply (vcc/vdd)
3 V ~ 3.6 V
Data Converters
A/D 12x10b; D/A 4x8b
Oscillator Type
Internal
Operating Temperature
-20°C ~ 75°C
Package / Case
144-QFP
Lead Free Status / RoHS Status
Contains lead / RoHS non-compliant
Eeprom Size
-

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Section 6 Bus Controller (BSC)
DRAM space read
External write
DRAM space read
T
T
T
T
T
T
T
T
T
T
p
r
c1
c2
i
1
2
3
c1
c2
Address bus
RD
HWR, LWR
RAS
UCAS, LCAS
Data bus
Idle cycle
Figure 6.77 Example of Idle Cycle Operation after DRAM Access
(Write after Read) (IDLC = 0, RAST = 0, CAST = 0)
Normal space access after DRAM space write access
While the ICIS2 bit is set to 1 in BCR (there is no ICRS2 bit in the H8S/2678 Group, therefore
this setting cannot be made) and a normal space read access occurs after DRAM space write
access, idle cycle is inserted in the first read cycle. The number of states of the idle cycle to be
inserted is in accordance with the setting of the IDLC bit. It does not depend on the DRMI bit in
DRACCR. Figure 6.78 shows an example of idle cycle operation when the ICIS2 bit is set to 1.
Rev. 3.00 Mar 17, 2006 page 242 of 926
REJ09B0283-0300

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