HD64F2676VFC33 Renesas Electronics America, HD64F2676VFC33 Datasheet - Page 923

IC H8S MCU FLASH 256K 144-QFP

HD64F2676VFC33

Manufacturer Part Number
HD64F2676VFC33
Description
IC H8S MCU FLASH 256K 144-QFP
Manufacturer
Renesas Electronics America
Series
H8® H8S/2600r
Datasheets

Specifications of HD64F2676VFC33

Core Processor
H8S/2600
Core Size
16-Bit
Speed
33MHz
Connectivity
IrDA, SCI
Peripherals
DMA, POR, PWM, WDT
Number Of I /o
103
Program Memory Size
256KB (256K x 8)
Program Memory Type
FLASH
Ram Size
8K x 8
Voltage - Supply (vcc/vdd)
3 V ~ 3.6 V
Data Converters
A/D 12x10b; D/A 4x8b
Oscillator Type
Internal
Operating Temperature
-20°C ~ 75°C
Package / Case
144-QFP
Lead Free Status / RoHS Status
Contains lead / RoHS non-compliant
Eeprom Size
-

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Clock Timing
Table 24.5 Clock Timing
Conditions: V
Note:
Item
Clock cycle time
Clock pulse high width
Clock pulse low width
Clock rise time
Clock fall time
Reset oscillation stabilization time
(crystal)
Software standby oscillation
stabilization time (crystal)
External clock output delay
stabilization time
Clock phase difference *
Clock pulse high width (SDRAM ) * t
Clock pulse low width (SDRAM ) *
Clock rise time (SDRAM ) *
Clock fall time (SDRAM ) *
* Not supported in the H8S/2678 Group.
T
a
CC
= 8 MHz to 33 MHz, T
= –40°C to +85°C (wide-range specifications)
= 3.0 V to 3.6 V, AV
Figure 24.2 System Clock Timing
Symbol Min
t
t
t
t
t
t
t
t
t
t
t
t
cyc
CH
CL
Cr
Cf
OSC1
OSC2
DEXT
cdif
SDCH
SDCL
sdcr
sdcf
a
CC
t
= –20°C to +75°C (regular specifications),
CH
= 3.0 V to 3.6 V, V
t
cyc
30.3
10
10
10
10
500
1/4
10
10
t
Cf
t
CL
t
cyc
– 3 1/4
Rev. 3.00 Mar 17, 2006 page 871 of 926
ref
t
Max
500
5
5
5
5
Cr
Section 24 Electrical Characteristics
= 3.0 V to AV
t
cyc
3 ns
Unit
ns
ns
ns
ns
ns
ms
ms
ns
ns
ns
ns
s
CC
, V
REJ09B0283-0300
Test Conditions
Figure 24.2
Figure 24.2
Figure 24.4 (1)
Figure 24.4 (2)
Figure 24.4 (1)
Figure 24.3
Figure 24.3
Figure 24.3
Figure 24.3
Figure 24.3
SS
= AV
SS
= 0 V,

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