HD64F2676VFC33 Renesas Electronics America, HD64F2676VFC33 Datasheet - Page 870

• Manufacturer Part Number: HD64F2676VFC33
• Description: IC H8S MCU FLASH 256K 144-QFP
• Manufacturer: Renesas Electronics America
• Series: H8® H8S/2600r

Specifications of HD64F2676VFC33

• Core Processor: H8S/2600
• Core Size: 16-Bit
• Speed: 33MHz
• Connectivity: IrDA, SCI
• Peripherals: DMA, POR, PWM, WDT
• Number Of I /o: 103
• Program Memory Size: 256KB (256K x 8)
• Program Memory Type: FLASH
• Ram Size: 8K x 8
• Voltage - Supply (vcc/vdd): 3 V ~ 3.6 V
• Data Converters: A/D 12x10b; D/A 4x8b
• Oscillator Type: Internal
• Operating Temperature: -20°C ~ 75°C
• Package / Case: 144-QFP
• Lead Free Status / RoHS Status: Contains lead / RoHS non-compliant
• Eeprom Size: -

Section 21 Clock Pulse Generator
consultation with the resonator manufacturer. The design must ensure that a voltage exceeding the
maximum rating is not applied to the oscillator pin.
21.5.3
When using the crystal resonator, place the crystal resonator and its load capacitors as close as
possible to the XTAL and EXTAL pins. Other signal lines should be routed away from the
oscillation circuit to prevent induction from interfering with correct oscillation. See figure 21.6.
Figure 21.7 shows the external circuitry recommended for the PLL circuit. Separate PLLVcc and
PLLVss from the other Vcc and Vss lines at the board power supply source, and be sure to insert
bypass capacitors CPB and CB close to the pins.
Rev. 3.00 Mar 17, 2006 page 818 of 926
REJ09B0283-0300
Notes on Board Design
Note: * CB and CPB are laminated ceramic capacitors.
Figure 21.7 Recommended External Circuitry for PLL Circuit
Figure 21.6 Note on Board Design for Oscillation Circuit
Avoid
C
C
L2
L1
PLLV
PLLV
V
V
CC
CC
SS
SS
Signal A Signal B
Rp: 200
CPB: 0.1 µF *
CB: 0.1 µF *
XTAL
EXTAL
This LSI