HD64F2676VFC33 Renesas Electronics America, HD64F2676VFC33 Datasheet - Page 871

IC H8S MCU FLASH 256K 144-QFP

HD64F2676VFC33

Manufacturer Part Number
HD64F2676VFC33
Description
IC H8S MCU FLASH 256K 144-QFP
Manufacturer
Renesas Electronics America
Series
H8® H8S/2600r
Datasheets

Specifications of HD64F2676VFC33

Core Processor
H8S/2600
Core Size
16-Bit
Speed
33MHz
Connectivity
IrDA, SCI
Peripherals
DMA, POR, PWM, WDT
Number Of I /o
103
Program Memory Size
256KB (256K x 8)
Program Memory Type
FLASH
Ram Size
8K x 8
Voltage - Supply (vcc/vdd)
3 V ~ 3.6 V
Data Converters
A/D 12x10b; D/A 4x8b
Oscillator Type
Internal
Operating Temperature
-20°C ~ 75°C
Package / Case
144-QFP
Lead Free Status / RoHS Status
Contains lead / RoHS non-compliant
Eeprom Size
-

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In addition to the normal program execution state, this LSI has power-down modes in which
operation of the CPU and oscillator is halted and power dissipation is reduced. Low-power
operation can be achieved by individually controlling the CPU, on-chip peripheral modules, and
so on.
This LSI’s operating modes are high-speed mode and six power down modes:
Sleep mode is a CPU state, clock division mode is a CPU and bus master state, and module stop
mode is an on-chip peripheral function (including bus masters other than the CPU) state. A
combination of these modes can be set.
After a reset, this LSI is in high-speed mode.
Table 22.1 shows the internal states of this LSI in each mode. Figure 21.1 shows the mode
transition diagram.
LPWS261A_010020020400
Clock division mode
Sleep mode
Module stop mode
All module clock stop mode
Software standby mode
Hardware standby mode
Section 22 Power-Down Modes
Rev. 3.00 Mar 17, 2006 page 819 of 926
Section 22 Power-Down Modes
REJ09B0283-0300

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