MCF5307AI90B Freescale Semiconductor, MCF5307AI90B Datasheet - Page 394

IC MPU 32BIT COLDF 90MHZ 208FQFP

MCF5307AI90B

Manufacturer Part Number
MCF5307AI90B
Description
IC MPU 32BIT COLDF 90MHZ 208FQFP
Manufacturer
Freescale Semiconductor
Series
MCF530xr
Datasheets

Specifications of MCF5307AI90B

Core Processor
Coldfire V3
Core Size
32-Bit
Speed
90MHz
Connectivity
EBI/EMI, I²C, UART/USART
Peripherals
DMA, POR, WDT
Number Of I /o
16
Program Memory Type
ROMless
Ram Size
4K x 8
Voltage - Supply (vcc/vdd)
3 V ~ 3.6 V
Oscillator Type
External
Operating Temperature
0°C ~ 70°C
Package / Case
208-FQFP
Maximum Clock Frequency
90 MHz
Maximum Operating Temperature
+ 105 C
Mounting Style
SMD/SMT
Minimum Operating Temperature
0 C
Family Name
MCF5xxx
Device Core
ColdFire
Device Core Size
32b
Frequency (max)
90MHz
Instruction Set Architecture
RISC
Supply Voltage 1 (typ)
3.3V
Operating Temp Range
0C to 70C
Operating Temperature Classification
Commercial
Mounting
Surface Mount
Pin Count
208
Package Type
FQFP
Program Memory Size
8KB
Cpu Speed
90MHz
Embedded Interface Type
I2C, UART
Digital Ic Case Style
FQFP
No. Of Pins
208
Supply Voltage Range
3V To 3.6V
Rohs Compliant
Yes
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Eeprom Size
-
Program Memory Size
-
Data Converters
-
Lead Free Status / Rohs Status
Lead free / RoHS Compliant

Available stocks

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Quantity
Price
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Manufacturer:
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Part Number:
MCF5307AI90B
Manufacturer:
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Quantity:
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Part Number:
MCF5307AI90B
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Data Transfer Operation
Table 18-4 describes the states as they appear in subsequent timing diagrams. Note that the
TT[1:0], TM[2:0], and TIP functions are chosen in the PAR, as described in Section 15.1.1,
“Pin Assignment Register (PAR).”
18-6
S0
S1
S2
S3
S4
State
All
All
Fast termination
Read/write
(skipped for fast
termination)
Write
Read/write
(skipped for fast
termination)
Read
All
Read (including
fast termination)
Cycle
Figure 18-4. Data Transfer State Transition Diagram
High
Low
High
Low
High
BCLKO
Freescale Semiconductor, Inc.
Next Cycle
S5
For More Information On This Product,
S4
The read or write cycle is initiated. On the rising edge of BCLKO, the MCF5307
places a valid address on the address bus, asserts TIP, and drives R/W high for
a read and low for a write, if these signals are not already in the appropriate
state. The MCF5307 asserts TT[1:0], TM[2:0], SIZ[1:0], and TS on the rising
edge of BCLKO.
AS asserts on the falling edge of BCLKO, indicating that the address and
attributes are stable. The appropriate CSx, BE/BWE, and OE signals assert on
the BCLKO falling edge.
TA must be asserted during S1. Data is made available by the external device
and is sampled on the rising edge of BCLKO with TA asserted.
TS is negated on the rising edge of BCLKO.
The data bus is driven out of high impedance as data is placed on the bus on
the rising edge of BCLKO.
The MCF5307 waits for TA assertion. If TA is not sampled as asserted before
the rising edge of BCLKO at the end of the first clock cycle, the MCF5307
inserts wait states (full clock cycles) until TA is sampled as asserted.
Data is made available by the external device on the falling edge of BCLKO and
is sampled on the rising edge of BCLKO with TA asserted.
The external device should negate TA.
The external device can stop driving data after the rising edge of BCLKO.
However, data could be driven up to S5.
Table 18-4. Bus Cycle States
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Termination
MCF5307 User’s Manual
Fast
S0
S3
Wait
States
Description
S1
S2
Basic
Read/Write

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