MCF5307AI90B Freescale Semiconductor, MCF5307AI90B Datasheet - Page 146

• Manufacturer Part Number: MCF5307AI90B
• Description: IC MPU 32BIT COLDF 90MHZ 208FQFP
• Manufacturer: Freescale Semiconductor
• Series: MCF530xr

Specifications of MCF5307AI90B

• Core Processor: Coldfire V3
• Core Size: 32-Bit
• Speed: 90MHz
• Connectivity: EBI/EMI, I²C, UART/USART
• Peripherals: DMA, POR, WDT
• Number Of I /o: 16
• Program Memory Type: ROMless
• Ram Size: 4K x 8
• Voltage - Supply (vcc/vdd): 3 V ~ 3.6 V
• Oscillator Type: External
• Operating Temperature: 0°C ~ 70°C
• Package / Case: 208-FQFP
• Maximum Clock Frequency: 90 MHz
• Maximum Operating Temperature: + 105 C
• Mounting Style: SMD/SMT
• Minimum Operating Temperature: 0 C
• Family Name: MCF5xxx
• Device Core: ColdFire
• Device Core Size: 32b
• Frequency (max): 90MHz
• Instruction Set Architecture: RISC
• Supply Voltage 1 (typ): 3.3V
• Operating Temp Range: 0C to 70C
• Operating Temperature Classification: Commercial
• Mounting: Surface Mount
• Pin Count: 208
• Package Type: FQFP
• Program Memory Size: 8KB
• Cpu Speed: 90MHz
• Embedded Interface Type: I2C, UART
• Digital Ic Case Style: FQFP
• No. Of Pins: 208
• Supply Voltage Range: 3V To 3.6V
• Rohs Compliant: Yes
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Eeprom Size: -
• Program Memory Size: -
• Data Converters: -
• Lead Free Status / Rohs Status: Lead free / RoHS Compliant

Background Debug Mode (BDM)
DSI must meet the required input setup and hold timings and the DSO is specified as a delay
relative to the rising edge of the processor clock. See Table 5-1. The development system
serves as the serial communication channel master and must generate DSCLK.
The serial channel operates at a frequency from DC to 1/5 of the processor frequency. The
channel uses full-duplex mode, where data is sent and received simultaneously by both
master and slave devices. The transmission consists of 17-bit packets composed of a
status/control bit and a 16-bit data word. As shown in Figure 5-13, all state transitions are
enabled on a rising edge of the processor clock when DSCLK is high; that is, DSI is
sampled and DSO is driven.
DSCLK and DSI are synchronized inputs. DSCLK acts as a pseudo clock enable and is
sampled on the rising edge of the processor CLK as well as the DSI. DSO is delayed from
the DSCLK-enabled CLK rising edge (registered after a BDM state machine state change).
All events in the debug module’s serial state machine are based on the processor clock
rising edge. DSCLK must also be sampled low (on a positive edge of CLK) between each
bit exchange. The MSB is transferred first. Because DSO changes state based on an
internally-recognized rising edge of DSCLK, DSDO cannot be used to indicate the start of
a serial transfer. The development system must count clock cycles in a given transfer.
C1–C4 are described as follows:
5-18
• C1—First synchronization cycle for DSI (DSCLK is high).
• C2—Second synchronization cycle for DSI (DSCLK is high).
• C3—BDM state machine changes state depending upon DSI and whether the entire
• C4—DSO changes to next value.
BDM State
CPU CLK
PSTCLK
input data transfer has been transmitted.
Machine
DSCLK
DSO
DSI
A not-ready response can be ignored except during a
memory-referencing cycle. Otherwise, the debug module can
accept a new serial transfer after 32 processor clock periods.
Figure 5-13. BDM Serial Interface Timing
Freescale Semiconductor, Inc.
For More Information On This Product,
Current State
Past
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C1
Current
MCF5307 User’s Manual
C2
NOTE:
C3
C4
Next State
Current
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