MCF5307AI90B Freescale Semiconductor, MCF5307AI90B Datasheet - Page 240

• Manufacturer Part Number: MCF5307AI90B
• Description: IC MPU 32BIT COLDF 90MHZ 208FQFP
• Manufacturer: Freescale Semiconductor
• Series: MCF530xr

Specifications of MCF5307AI90B

• Core Processor: Coldfire V3
• Core Size: 32-Bit
• Speed: 90MHz
• Connectivity: EBI/EMI, I²C, UART/USART
• Peripherals: DMA, POR, WDT
• Number Of I /o: 16
• Program Memory Type: ROMless
• Ram Size: 4K x 8
• Voltage - Supply (vcc/vdd): 3 V ~ 3.6 V
• Oscillator Type: External
• Operating Temperature: 0°C ~ 70°C
• Package / Case: 208-FQFP
• Maximum Clock Frequency: 90 MHz
• Maximum Operating Temperature: + 105 C
• Mounting Style: SMD/SMT
• Minimum Operating Temperature: 0 C
• Family Name: MCF5xxx
• Device Core: ColdFire
• Device Core Size: 32b
• Frequency (max): 90MHz
• Instruction Set Architecture: RISC
• Supply Voltage 1 (typ): 3.3V
• Operating Temp Range: 0C to 70C
• Operating Temperature Classification: Commercial
• Mounting: Surface Mount
• Pin Count: 208
• Package Type: FQFP
• Program Memory Size: 8KB
• Cpu Speed: 90MHz
• Embedded Interface Type: I2C, UART
• Digital Ic Case Style: FQFP
• No. Of Pins: 208
• Supply Voltage Range: 3V To 3.6V
• Rohs Compliant: Yes
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Eeprom Size: -
• Program Memory Size: -
• Data Converters: -
• Lead Free Status / Rohs Status: Lead free / RoHS Compliant

Asynchronous Operation
Table 11-4 describes DACRn fields.
11-6
Reset
31–18
17–16
13–12
11–10
Field
Addr
Bits
R/W
15
14
9
8
7
6
31
RNCN RAS-negate-to-CAS-negate. Controls whether RAS and CAS negate concurrently or one clock
Name
RCD
EDO
Figure 11-3. DRAM Address and Control Registers (DACR0/DACR1)
CAS
BA
RE
RP
—
—
—
Base address. Used with DMR[BAM] to determine the address range in which the associated
DRAM block is located. Each BA bit is compared with the corresponding address of the bus cycle in
progress. If each bit matches, or if bits that do not match are masked in the BAM, the address
selects the associated DRAM block.
Reserved, should be cleared.
Refresh enable. Determines whether the DRAM controller generates a refresh to the associated
DRAM block. DRAM contents are not preserved during hard reset or software watchdog reset.
0 Do not refresh associated DRAM block. (Default at reset)
1 Refresh associated DRAM block.
Reserved, should be cleared.
CAS timing. Determines how long CAS is asserted during a DRAM access.
00 1 clock cycle
01 2 clock cycles
10 3 clock cycles
11 4 clock cycles
RAS precharge timing. Determines how long RAS is precharged between accesses. Note that RP
is different from DCR[RRP].
00 1 clock cycle
01 2 clock cycles
10 3 clock cycles
11 4 clock cycles
apart. RNCN is ignored if CAS is asserted for only one clock and both RAS and CAS are negated.
RNCN is used only for non-page-mode accesses and single accesses in page mode.
0 RAS negates concurrently with CAS.
1 RAS negates one clock before CAS.
RAS-to-CAS delay. Determines the number of system clocks between assertions of RAS and CAS.
0 1 clock cycle
1 2 clock cycles
Reserved, should be cleared.
Extended data out. Determines whether the DRAM block operates in a mode to take advantage of
industry-standard EDO DRAMs. Do not use EDO mode with non-EDO DRAM.
0 EDO operation disabled.
1 EDO operation enabled.
Unitialized
BA
Table 11-4. DACR0/DACR1 Field Description
Freescale Semiconductor, Inc.
For More Information On This Product,
18 17 16
MBAR + 0x10C (DACR0); 0x110 (DACR1)
Go to: www.freescale.com
—
MCF5307 User’s Manual
RE — CAS
15
0
14 13 12 11 10
R/W
Description
RP
RNCN RCD — EDO
9
Unitialized
8
7
6
5
PS
4
3
PM
2
1
—
0