MCF5307AI90B Freescale Semiconductor, MCF5307AI90B Datasheet - Page 252

• Manufacturer Part Number: MCF5307AI90B
• Description: IC MPU 32BIT COLDF 90MHZ 208FQFP
• Manufacturer: Freescale Semiconductor
• Series: MCF530xr

Specifications of MCF5307AI90B

• Core Processor: Coldfire V3
• Core Size: 32-Bit
• Speed: 90MHz
• Connectivity: EBI/EMI, I²C, UART/USART
• Peripherals: DMA, POR, WDT
• Number Of I /o: 16
• Program Memory Type: ROMless
• Ram Size: 4K x 8
• Voltage - Supply (vcc/vdd): 3 V ~ 3.6 V
• Oscillator Type: External
• Operating Temperature: 0°C ~ 70°C
• Package / Case: 208-FQFP
• Maximum Clock Frequency: 90 MHz
• Maximum Operating Temperature: + 105 C
• Mounting Style: SMD/SMT
• Minimum Operating Temperature: 0 C
• Family Name: MCF5xxx
• Device Core: ColdFire
• Device Core Size: 32b
• Frequency (max): 90MHz
• Instruction Set Architecture: RISC
• Supply Voltage 1 (typ): 3.3V
• Operating Temp Range: 0C to 70C
• Operating Temperature Classification: Commercial
• Mounting: Surface Mount
• Pin Count: 208
• Package Type: FQFP
• Program Memory Size: 8KB
• Cpu Speed: 90MHz
• Embedded Interface Type: I2C, UART
• Digital Ic Case Style: FQFP
• No. Of Pins: 208
• Supply Voltage Range: 3V To 3.6V
• Rohs Compliant: Yes
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Eeprom Size: -
• Program Memory Size: -
• Data Converters: -
• Lead Free Status / Rohs Status: Lead free / RoHS Compliant

Synchronous Operation
Figure 11-13 shows a typical signal configuration for synchronous mode.
11.4.2 Using Edge Select (EDGESEL)
EDGESEL can ease system-level timings (note that the optional buffer in Figure 11-13 is
for memories that need extra delay). The clock at the input to the SDRAM is monitored and
data is held until the next edge of the bus clock, adding required output hold time to the
address, data, and control signals.
To generate SDRAM interface timing, address, data, and control signals are clocked
through a two-stage shift register. The first stage is clocked on the rising edge of BCLKO;
the second is clocked on the falling edge. This makes the signal available for up to an
additional half bus clock cycle, of which only a small amount is needed for proper timing.
Using the connection shown in Figure 11-13 ensures that data remains held for a longer
time after the rising edge of the SDRAM clock input. This helps to match the MCF5307
output timing with the SDRAM clock.
Figure 11-14 shows the output wave forms for the interface signals changing on the rising
edge (A) and falling edge (B) of BCLKO as determined by whether EDGESEL is tied high
or low. It also shows timing (C) with EDGESEL tied to buffered BCLKO.
11-18
BCLKO
EDGESEL Synchronous edge select. Provides additional output hold time for signals that interface to external
Signal
Table 11-11. Synchronous DRAM Signal Connections (Continued)
Bus clock output. Connects to the CLK input of SDRAMs.
SDRAMs. EDGESEL supports the three following modes for SDRAM interface signals:
EDGESEL can provide additional output hold time for SDRAM interface signals, however the SDRAM
clock and BCLKO frequencies must be the same. See Section 11.4.2, “Using Edge Select (EDGESEL).”
• Tied high. Signals change on the rising edge of BCLKO.
• Tied low. Signals change on the falling edge of BCLKO.
• Tied to buffered BCLKO. Signals change on the rising edge of the buffered clock.
1
Trace length from buffer to CLK must equal length from buffer to EDGESEL.
MCF5307
Figure 11-13. MCF5307 SDRAM Interface
Freescale Semiconductor, Inc.
EDGESEL
For More Information On This Product,
DRAMW
BCLKO
A[31:0]
D[31:0]
SCAS
SRAS
SCKE
CAS
Go to: www.freescale.com
MCF5307 User’s Manual
1
Description
ADDRESS
DATA
DQM
WE
CAS
RAS
CKE
CLK
SDRAM