MCF5307AI90B Freescale Semiconductor, MCF5307AI90B Datasheet - Page 29

IC MPU 32BIT COLDF 90MHZ 208FQFP

MCF5307AI90B

Manufacturer Part Number
MCF5307AI90B
Description
IC MPU 32BIT COLDF 90MHZ 208FQFP
Manufacturer
Freescale Semiconductor
Series
MCF530xr
Datasheets

Specifications of MCF5307AI90B

Core Processor
Coldfire V3
Core Size
32-Bit
Speed
90MHz
Connectivity
EBI/EMI, I²C, UART/USART
Peripherals
DMA, POR, WDT
Number Of I /o
16
Program Memory Type
ROMless
Ram Size
4K x 8
Voltage - Supply (vcc/vdd)
3 V ~ 3.6 V
Oscillator Type
External
Operating Temperature
0°C ~ 70°C
Package / Case
208-FQFP
Maximum Clock Frequency
90 MHz
Maximum Operating Temperature
+ 105 C
Mounting Style
SMD/SMT
Minimum Operating Temperature
0 C
Family Name
MCF5xxx
Device Core
ColdFire
Device Core Size
32b
Frequency (max)
90MHz
Instruction Set Architecture
RISC
Supply Voltage 1 (typ)
3.3V
Operating Temp Range
0C to 70C
Operating Temperature Classification
Commercial
Mounting
Surface Mount
Pin Count
208
Package Type
FQFP
Program Memory Size
8KB
Cpu Speed
90MHz
Embedded Interface Type
I2C, UART
Digital Ic Case Style
FQFP
No. Of Pins
208
Supply Voltage Range
3V To 3.6V
Rohs Compliant
Yes
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Eeprom Size
-
Program Memory Size
-
Data Converters
-
Lead Free Status / Rohs Status
Lead free / RoHS Compliant

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
MCF5307AI90B
Manufacturer:
FREESCAL
Quantity:
153
Part Number:
MCF5307AI90B
Manufacturer:
Freescale Semiconductor
Quantity:
10 000
Part Number:
MCF5307AI90B
Manufacturer:
FREESCALE
Quantity:
20 000
Table
Number
17-10
17-11
17-12
17-13
17-14
17-15
17-16
18-1
18-2
18-3
18-4
18-5
18-6
18-7
18-8
18-9
18-10
18-11
18-12
19-1
19-2
19-3
19-4
20-1
20-2
20-3
20-4
20-5
20-6
20-7
20-8
20-9
20-10
20-11
20-12
20-13
20-14
20-15
A-1
A-2
A-3
A-4
A-5
Data Pin Configuration ............................................................................................. 17-12
D7 Selection of CS0 Automatic Acknowledge ........................................................ 17-13
D6 and D5 Selection of CS0 Port Size ..................................................................... 17-13
D4/ADDR_CONFIG, Address Pin Assignment....................................................... 17-13
CLKIN Frequency .................................................................................................... 17-13
BCLKO/PSTCLK Divide Ratios.............................................................................. 17-14
Processor Status Signal Encodings ........................................................................... 17-19
ColdFire Bus Signal Summary ................................................................................... 18-1
Bus Cycle Size Encoding............................................................................................ 18-3
Accesses by Matches in CSCRs and DACRs ............................................................. 18-5
Bus Cycle States ......................................................................................................... 18-6
Allowable Line Access Patterns ............................................................................... 18-12
MCF5307 Arbitration Protocol States ...................................................................... 18-20
ColdFire Bus Arbitration Signal Summary............................................................... 18-21
Cycles for Basic No-Wait-State External Master Access......................................... 18-23
Cycles for External Master Burst Line Access to 32-Bit Port .................................. 18-24
MCF5307 Two-Wire Bus Arbitration Protocol Transition Conditions.................... 18-28
Three-Wire Bus Arbitration Protocol Transition Conditions ................................... 18-32
Data Pin Configuration ............................................................................................. 18-35
JTAG Pin Descriptions ............................................................................................... 19-3
JTAG Instructions....................................................................................................... 19-5
IDCODE Bit Assignments.......................................................................................... 19-6
Boundary-Scan Bit Definitions................................................................................... 19-7
Absolute Maximum Ratings ....................................................................................... 20-1
Operating Temperatures.............................................................................................. 20-1
DC Electrical Specifications ....................................................................................... 20-2
Clock Timing Specification ........................................................................................ 20-2
Input AC Timing Specification................................................................................... 20-3
Output AC Timing Specification ................................................................................ 20-4
Reset Timing Specification....................................................................................... 20-12
Debug AC Timing Specification .............................................................................. 20-12
Timer Module AC Timing Specification.................................................................. 20-14
I
I
UART Module AC Timing Specifications ............................................................... 20-16
General-Purpose I/O Port AC Timing Specifications............................................... 20-18
DMA AC Timing Specifications .............................................................................. 20-19
IEEE 1149.1 (JTAG) AC Timing Specifications ..................................................... 20-20
SIM Registers............................................................................................................... A-1
Interrupt Controller Registers ...................................................................................... A-1
Chip-Select Registers................................................................................................... A-2
DRAM Controller Registers ........................................................................................ A-3
General-Purpose Timer Registers ................................................................................ A-4
2
2
C Input Timing Specifications between SCL and SDA......................................... 20-15
C Output Timing Specifications between SCL and SDA ...................................... 20-15
Freescale Semiconductor, Inc.
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TABLES
Tables
Title
Number
Page
xxix

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