LM3S600-IQN20-A0T Bookham Technology, Inc., LM3S600-IQN20-A0T Datasheet - Page 358
![no-image](/images/no-image-200.jpg)
LM3S600-IQN20-A0T
Manufacturer Part Number
LM3S600-IQN20-A0T
Description
Microcontroller
Manufacturer
Bookham Technology, Inc.
Datasheet
1.LM3S600-IQN20-A0T.pdf
(378 pages)
- Current page: 358 of 378
- Download datasheet (4Mb)
Package Information
19
358
Package Information
Figure 19-1. 48-Pin LQFP Package
Note:
1.
2.
3.
4.
5.
6.
All dimensions are in mm. All dimensioning and tolerancing conform to ANSI Y14.5M-1982.
The top package body size may be smaller than the bottom package body size by as much as
0.20.
Datums A-B and -D- to be determined at datum plane -H-.
To be determined at seating plane -C-.
Dimensions D1 and E1 do not include mold protrusion. Allowable protrusion is 0.25 per side.
D1 and E1 are maximum plastic body size dimensions including mold mismatch.
Surface finish of the package is #24-27 Charmille (1.6-2.3μmR0) Pin 1 and ejector pin may be
less than 0.1μmR0.
The following notes apply to the package drawing.
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ccc
Preliminary
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October 01, 2007
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