tmp1940cyaf TOSHIBA Semiconductor CORPORATION, tmp1940cyaf Datasheet - Page 447

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tmp1940cyaf

Manufacturer Part Number
tmp1940cyaf
Description
32-bit Tx System Risc Tx19 Family
Manufacturer
TOSHIBA Semiconductor CORPORATION
Datasheet
4.
4.1
Electrical Characteristics
The letter x in equations presented in this chapter represents the cycle period of the fsys clock selected
through the programming of the SYSCR1.SYSCK bit. The fsys clock may be derived from either the high-
speed or low-speed crystal oscillator. The programming of the clock gear function also affects the fsys
frequency. All relevant values in this chapter are calculated with the high-speed (fc) system clock
(SYSCR1.SYSCK = 0) and a clock gear factor of 1/fc (SYSCR1.GEAR[1:0] = 00).
Maximum Ratings
Note:
Supply voltage
Input voltage
Low-level output
current
High-level output
current
Power dissipation (Ta = 85°C)
Soldering temperature (10 s)
Storage temperature
Operating
temperature
Write/erase cycles
Maximum ratings are limiting values of operating and environmental conditions which
should not be exceeded under the worst possible conditions. The equipment manufacturer
should design so that no maximum rating value is exceeded with respect to current,
voltage, power dissipation, temperature, etc. Exposure to conditions beyond those listed
above may cause permanent damage to the device or affect device reliability, which could
increase potential risks of personal injury due to IC blowup and/or burning.
Parameter
Except during flash W/E
During flash W/E
Per pin
Total
Per pin
Total
TMP1940FDBF-89
V
V
I
I
PD
T
T
T
N
Symbol
OL
OH
I
I
SOLDER
STG
OPR
CC
IN
EW
OL
OH
–0.5 to V
–0.5 to 4.0
–65 to 150
–40 to 85
Rating
0 to 70
–80
600
260
100
80
–5
5
CC
0.5
TMP1940FDBF
Cycles
Unit
mW
mA
°C
°C
°C
V
V

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