tmp1940cyaf TOSHIBA Semiconductor CORPORATION, tmp1940cyaf Datasheet - Page 32

• Manufacturer Part Number: tmp1940cyaf
• Description: 32-bit Tx System Risc Tx19 Family
• Manufacturer: TOSHIBA Semiconductor CORPORATION

(1) Using a soldering iron
Complete soldering within ten seconds for lead temperatures of up to 260°C, or within three
seconds for lead temperatures of up to 350°C.
(2) Using medium infrared ray reflow
(3) Using hot air reflow
(4) Using solder flow
Heating top and bottom with long or medium infrared rays is recommended (see Figure 3).
Complete the infrared ray reflow process within 30 seconds at a package surface temperature
of between 210°C and 240°C.
Refer to Figure 4 for an example of a good temperature profile for infrared or hot air reflow.
Complete hot air reflow within 30 seconds at a package surface temperature of between 210°C
and 240°C.
For an example of a recommended temperature profile, refer to Figure 4 above.
Apply preheating for 60 to 120 seconds at a temperature of 150°C.
For lead insertion-type packages, complete solder flow within 10 seconds with the
temperature at the stopper (or, if there is no stopper, at a location more than 1.5 mm from
the body) which does not exceed 260°C.
For surface-mount packages, complete soldering within 5 seconds at a temperature of 250°C or
Figure 3 Heating top and bottom with long or medium infrared rays
Figure 4 Sample temperature profile for infrared or hot air reflow
Product flow
Long infrared ray heater (preheating)
(°C)
240
210
160
140
3 General Safety Precautions and Usage Considerations
seconds
60-120
18
Time (in seconds)
Medium infrared ray heater
(reflow)
30
seconds
or less