tmp1940cyaf TOSHIBA Semiconductor CORPORATION, tmp1940cyaf Datasheet - Page 287

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tmp1940cyaf

Manufacturer Part Number
tmp1940cyaf
Description
32-bit Tx System Risc Tx19 Family
Manufacturer
TOSHIBA Semiconductor CORPORATION
Datasheet
18. Electrical Characteristics
18.1 Maximum Ratings
The letter x in equations presented in this chapter represents the cycle period of the fsys clock selected
through the programming of the SYSCR1.SYSCK bit. The fsys clock may be derived from either the high-
speed or low-speed crystal oscillator. The programming of the clock gear function also affects the fsys
frequency. All relevant values in this chapter are calculated with the high-speed (fc) system clock
(SYSCR1.SYSCK=0) and a clock gear factor of 1/fc (SYSCR1.GEAR[1:0]=00).
Supply voltage
Input voltage
Low-level output current
High-level output current
Power dissipation (Ta = 85°C)
Soldering temperature (10 s)
Storage temperature
Operating temperature
V
Note:
CC
= DV
Maximum ratings are limiting values of operating and environmental conditions which should not
be exceeded under the worst possible conditions. The equipment manufacturer should design so
that no maximum rating value is exceeded with respect to current, voltage, power dissipation,
temperature, etc. Exposure to conditions beyond those listed above may cause permanent
damage to the device or affect device reliability, which could increase potential risks of personal
injury due to IC blowup and/or burning.
CC
Parameter
= AV
CC
; V
SS
Per pin
Total
Per pin
Total
= DV
SS
= AV
TMP1940CYAF-245
SS
V
V
I
I
PD
T
T
T
OL
OH
I
I
SOLDER
STG
OPR
CC
IN
OL
OH
Symbol
0.5 to V
0.5 to 4.0
65 to 150
Rating
40 to 85
600
260
80
5
80
5
CC
0.5
TMP1940CYAF
Unit
mW
mA
°C
°C
°C
V
V

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