UPD78F0138HGK-9ET-A Renesas Electronics America, UPD78F0138HGK-9ET-A Datasheet - Page 517

• Manufacturer Part Number: UPD78F0138HGK-9ET-A
• Description: MCU 8BIT 60K FLASH 64TQFP
• Manufacturer: Renesas Electronics America
• Series: 78K0/Kx1+r

Specifications of UPD78F0138HGK-9ET-A

• Core Processor: 78K/0
• Core Size: 8-Bit
• Speed: 16MHz
• Connectivity: 3-Wire SIO, LIN, UART/USART
• Peripherals: LVD, POR, PWM, WDT
• Number Of I /o: 42
• Program Memory Size: 60KB (60K x 8)
• Program Memory Type: FLASH
• Ram Size: 2K x 8
• Voltage - Supply (vcc/vdd): 2.5 V ~ 5.5 V
• Data Converters: A/D 8x10b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 85°C
• Package / Case: *
• Lead Free Status / RoHS Status: Contains lead / RoHS non-compliant
• Eeprom Size: -

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Note After opening the dry pack, store it at 25 C or less and 65% RH or less for the allowable storage period.
Caution Do not use different soldering methods together (except for partial heating).
Infrared reflow
VPS
Partial heating
Soldering Method
These products should be soldered and mounted under the following recommended conditions.
For soldering methods and conditions other than those recommended below, please contact an NEC Electronics
For technical information, see the following website.
Semiconductor Device Mount Manual (http://www.necel.com/pkg/en/mount/index.html)
78F0132HGK(A)-9ET, 78F0132HGK(A1)-9ET, 78F0133HGB-8EU, 78F0133HGB(A)-8EU,
78F0133HGB(A1)-8EU, 78F0133HGK-9ET, 78F0133HGK(A)-9ET, 78F0133HGK(A1)-9ET,
78F0134HGB-8EU, 78F0134HGB(A)-8EU, 78F0134HGB(A1)-8EU, 78F0134HGK-9ET, 78F0134HGK(A)-9ET,
78F0134HGK(A1)-9ET, 78F0136HGB-8EU, 78F0136HGB(A)-8EU, 78F0136HGB(A1)-8EU,
78F0136HGK-9ET, 78F0136HGK(A)-9ET, 78F0136HGK(A1)-9ET, 78F0138HGB-8EU, 78F0138HGB(A)-8EU,
78F0138HGB(A1)-8EU, 78F0138HGK-9ET, 78F0138HGK(A)-9ET, 78F0138HGK(A1)-9ET
PD78F0132HGB-8EU, 78F0132HGB(A)-8EU, 78F0132HGB(A1)-8EU, 78F0132HGK-9ET,
Package peak temperature: 235 C, Time: 30 seconds max. (at 210 C or higher),
Count: 3 times or less, Exposure limit: 7 days
20 to 72 hours)
Pin temperature: 350 C max., Time: 3 seconds max. (per pin row)
Package peak temperature: 215 C, Time: 40 seconds max. (at 200 C or higher),
Count: 3 times or less, Exposure limit: 7 days
20 to 72 hours)
CHAPTER 32 RECOMMENDED SOLDERING CONDITIONS
Table 32-1. Surface Mounting Type Soldering Conditions (1/3)
User’s Manual U16899EJ3V0UD
Soldering Conditions
Note
Note
(after that, prebake at 125 C for
(after that, prebake at 125 C for
IR35-207-3
VP15-207-3
Condition Symbol
Recommended
515