HD64F2168VTE33 Renesas Electronics America, HD64F2168VTE33 Datasheet - Page 858

• Manufacturer Part Number: HD64F2168VTE33
• Manufacturer: Renesas Electronics America

Specifications of HD64F2168VTE33

• Cpu Family: H8S
• Device Core Size: 16/32Bit
• Frequency (max): 33MHz
• Interface Type: I2C/IrDA/SCI
• Program Memory Type: Flash
• Program Memory Size: 256KB
• Total Internal Ram Size: 40KB
• # I/os (max): 106
• Number Of Timers - General Purpose: 5
• Operating Supply Voltage (typ): 3.3V
• Operating Supply Voltage (max): 3.6V
• Operating Supply Voltage (min): 3V
• On-chip Adc: 8-chx10-bit
• On-chip Dac: 2-chx8-bit
• Instruction Set Architecture: CISC
• Operating Temp Range: -20C to 75C
• Operating Temperature Classification: Commercial
• Mounting: Surface Mount
• Pin Count: 144
• Package Type: TQFP
• Lead Free Status / Rohs Status: Not Compliant

25.7
It is necessary to connect a bypass capacitor between the VCC pin and VSS pin and a capacitor
between the VCL pin and VSS pin for stable internal step-down power. An example of connection
is shown in figure 25.35.
It is recommended that a bypass capacitor be connected to
the VCC pin. (The values are reference values.)
When connecting, place a bypass capacitor near the pin.
Rev. 3.00, 03/04, page 816 of 830
Bypass
capacitor
Vcc power supply
10 µF
Usage Notes
0.01 µF
VCC
VSS
Figure 25.35 Connection of VCL Capacitor
One 0.1 µF / 0.47 µF or
two in parallel
External capacitor
for internal step-down
power stabilization
Do not connect Vcc power supply to the VCL pin.
Always connect a capacitor for internal step-down power
stabilization.
Use one or two ceramic multilayer capacitor(s)
(0.1 µF / 0.47 µF: connect in parallel when using two)
and place it (them) near the pin.
VCL
VSS