HD64F2168VTE33 Renesas Electronics America, HD64F2168VTE33 Datasheet - Page 475

• Manufacturer Part Number: HD64F2168VTE33
• Manufacturer: Renesas Electronics America

Specifications of HD64F2168VTE33

• Cpu Family: H8S
• Device Core Size: 16/32Bit
• Frequency (max): 33MHz
• Interface Type: I2C/IrDA/SCI
• Program Memory Type: Flash
• Program Memory Size: 256KB
• Total Internal Ram Size: 40KB
• # I/os (max): 106
• Number Of Timers - General Purpose: 5
• Operating Supply Voltage (typ): 3.3V
• Operating Supply Voltage (max): 3.6V
• Operating Supply Voltage (min): 3V
• On-chip Adc: 8-chx10-bit
• On-chip Dac: 2-chx8-bit
• Instruction Set Architecture: CISC
• Operating Temp Range: -20C to 75C
• Operating Temperature Classification: Commercial
• Mounting: Surface Mount
• Pin Count: 144
• Package Type: TQFP
• Lead Free Status / Rohs Status: Not Compliant

14.11.4 Note on CRC Operation Circuit
Note that the sequence to transmit the CRC code differs between LSB-first transmission and
MSB-first transmission.
1. CRC code generation
2. Transmission data
After specifying the operation method, write data to CRCDIR in the sequence of (1) → (2) → (3) → (4).
(i) LSB-first transmission
(ii) MSB-first transmission
Output
CRCDIR
CRCDORH
CRCDORL
Figure 14.50 LSB-First and MSB-First Transmit Data
7
7
7
7
(1) → (2) → (3) → (4)
(5)
(1)
CRC code
0
0
7
7
(5)
(6)
(6)
(2)
CRC code generation
0
0
7
7
(3)
(4)
0
0
0
0
7
7
(4)
(3)
0
0
7
7
Rev. 3.00, 03/04, page 433 of 830
(2)
(5)
CRC code
0
0
7
7
(1)
(6)
0
0
Output