HD64F2168VTE33 Renesas Electronics America, HD64F2168VTE33 Datasheet - Page 731

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HD64F2168VTE33

Manufacturer Part Number
HD64F2168VTE33
Description
Manufacturer
Renesas Electronics America
Datasheet

Specifications of HD64F2168VTE33

Cpu Family
H8S
Device Core Size
16/32Bit
Frequency (max)
33MHz
Interface Type
I2C/IrDA/SCI
Program Memory Type
Flash
Program Memory Size
256KB
Total Internal Ram Size
40KB
# I/os (max)
106
Number Of Timers - General Purpose
5
Operating Supply Voltage (typ)
3.3V
Operating Supply Voltage (max)
3.6V
Operating Supply Voltage (min)
3V
On-chip Adc
8-chx10-bit
On-chip Dac
2-chx8-bit
Instruction Set Architecture
CISC
Operating Temp Range
-20C to 75C
Operating Temperature Classification
Commercial
Mounting
Surface Mount
Pin Count
144
Package Type
TQFP
Lead Free Status / Rohs Status
Not Compliant

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• ERROR: (1 byte): Error code
(10) Erasure
Erasure is performed with the erasure selection and block erasure command.
Firstly, erasure is selected by the erasure selection command and the boot program then erases the
specified block. The command should be repeatedly executed if two or more blocks are to be
erased. Sending a block-erasure command from the host with the block number H'FF will stop the
erasure operating. On completion of erasing, the boot program will wait for selection of
programming or erasing.
The sequences of issuing the erasure selection command and block-erasure command are shown in
figure 20.24.
Repeat
H'11: Checksum error
H'2A: Address error
H'53: Programming error
An error has occurred in programming and programming cannot be continued.
Host
Figure 20.24 Erasure Sequence
Preparation for erasure (H'48)
Erasure (Erasure block number)
Erasure (H'FF)
ACK
ACK
ACK
Rev. 3.00, 03/04, page 689 of 830
Transfer of erasure
Boot program
Erasure
program

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