PI7C9X130DNDE Pericom Semiconductor, PI7C9X130DNDE Datasheet - Page 161

• Manufacturer Part Number: PI7C9X130DNDE
• Description: IC PCIE-PCIX BRIDGE 1PORT 256BGA
• Manufacturer: Pericom Semiconductor

Specifications of PI7C9X130DNDE

• Applications: PCI-to-PCI Bridge
• Interface: SMBus (2-Wire/I²C)
• Voltage - Supply: 1.8V, 3.3V
• Package / Case: 256-PBGA
• Mounting Type: Surface Mount
• Operating Temperature (min): -40C
• Operating Temperature Classification: Industrial
• Operating Temperature (max): 85C
• Package Type: BGA
• Rad Hardened: No
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant

PERICOM SEMICONDUCTOR - Confidential
1. Maximum Tj is 125oC. This is the junction temperature of the IC.
2. Since there is no way to measure actual Tj, we use the following formula to calculate this number:
1. Using typical power of 2W and 75oC ambient temperature in the calculation:
2.
Figure 16-18 PCI Signal Timing Conditions
PI7C9X130 PBGA256 17x17 Thermal Data:
TA = 75oC
Calculation formula:
Where: Ta : Ambient temperature, and Tc : Case temperature.
Example:
From first formula: Tj = 24.2 * 2 + 75 = 123.4oC. From second formula, the maximum Tc = 125oC –
7.2 * 2 = 110.6oC
a.
b. Tj =
c.
Air Flow
θ
θ
Max Power (W)
JC
JA
Tj =
Maximum Tc = Tj -
θ
θ
JA
JC
* Power + Ta
* Power + Tc or
θ
JC
* Power
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0 m/s
24.2
2.07
1 m/s
21.3
2.35
7.2
PCI EXPRESS TO PCI-X BRIDGE
Mar 2010 - Rev 2.0
2 m/s
20.1
2.49
PI7C9X130