S9S12XS256J0CAL Freescale Semiconductor, S9S12XS256J0CAL Datasheet - Page 561

• Manufacturer Part Number: S9S12XS256J0CAL
• Description: MCU 256K FLASH 112-LQFP
• Manufacturer: Freescale Semiconductor
• Series: HCS12r

Specifications of S9S12XS256J0CAL

• Core Processor: HCS12X
• Core Size: 16-Bit
• Speed: 40MHz
• Connectivity: CAN, SCI, SPI
• Peripherals: LVD, POR, PWM, WDT
• Number Of I /o: 91
• Program Memory Size: 256KB (256K x 8)
• Program Memory Type: FLASH
• Eeprom Size: 8K x 8
• Ram Size: 12K x 8
• Voltage - Supply (vcc/vdd): 1.72 V ~ 5.5 V
• Data Converters: A/D 16x12b
• Oscillator Type: External
• Operating Temperature: -40°C ~ 85°C
• Package / Case: 112-LQFP
• Processor Series: S12XS
• Core: HCS12
• Data Bus Width: 16 bit
• Data Ram Size: 12 KB
• Interface Type: CAN, SCI, SPI
• Maximum Clock Frequency: 40 MHz
• Number Of Programmable I/os: 91
• Number Of Timers: 12
• Maximum Operating Temperature: + 85 C
• Mounting Style: SMD/SMT
• 3rd Party Development Tools: EWHCS12
• Development Tools By Supplier: DEMO9S12XSFAME, EVB9S12XEP100
• Minimum Operating Temperature: - 40 C
• On-chip Adc: 12 bit, 16 Channel
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant

19.3.1
The S12X architecture places the P-Flash memory between global addresses 0x7E_0000 and 0x7F_FFFF
as shown in
The FPROT register, described in
accidental program or erase. Three separate memory regions, one growing upward from global address
0x7F_8000 in the Flash memory (called the lower region), one growing downward from global address
0x7F_FFFF in the Flash memory (called the higher region), and the remaining addresses in the Flash
memory, can be activated for protection. The Flash memory addresses covered by these protectable regions
are shown in the P-Flash memory map. The higher address region is mainly targeted to hold the boot loader
code since it covers the vector space. Default protection settings as well as security information that allows
the MCU to restrict access to the Flash module are stored in the Flash configuration field as described in
Table
Freescale Semiconductor
1
2
0x7F_FF08 – 0x7F_FF0B
0x7F_FF00 – 0x7F_FF07
Older versions may have swapped protection byte addresses
0x7FF08 - 0x7F_FF0F form a Flash phrase and must be programmed in a single command write sequence. Each byte in
the 0x7F_FF08 - 0x7F_FF0B reserved field should be programmed to 0xFF.
19-3.
Global Address
0x7F_FF0C
0x7F_FF0D
0x7F_FF0E
0x7F_FF0F
Module Memory Map
Table
0x7E_0000 – 0x7F_FFFF
2
2
2
2
19-2. The P-Flash memory map is shown in
Global Address
2
(Bytes)
Size
8
4
1
1
1
1
Table 19-2. P-Flash Memory Addressing
Section
S12XS Family Reference Manual, Rev. 1.11
Table 19-3. Flash Configuration Field
Backdoor Comparison Key
Refer to
Section 19.5.1, “Unsecuring the MCU using Backdoor Key
Reserved
P-Flash Protection byte
Refer to
D-Flash Protection byte
Refer to
Flash Nonvolatile byte
Refer to
Flash Security byte
Refer to
19.3.2.9, can be set to protect regions in the Flash memory from
(Bytes)
128 K
Section 19.4.2.11, “Verify Backdoor Access Key
Section 19.3.2.9, “P-Flash Protection Register (FPROT)”
Section 19.3.2.10, “D-Flash Protection Register (DFPROT)”
Section 19.3.2.15, “Flash Option Register (FOPT)”
Section 19.3.2.2, “Flash Security Register (FSEC)”
Size
P-Flash Block 0
Contains Flash Configuration Field
(see
Table
.
.
19-3)
Figure
Description
Description
128 KByte Flash Module (S12XFTMR128K1V1)
19-2.
1
Command,” and
Access”
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