MC9S12C128VFU Freescale Semiconductor, MC9S12C128VFU Datasheet - Page 683

• Manufacturer Part Number: MC9S12C128VFU
• Manufacturer: Freescale Semiconductor

Specifications of MC9S12C128VFU

• Cpu Family: HCS12
• Device Core Size: 16b
• Frequency (max): 25MHz
• Interface Type: CAN/SCI/SPI
• Program Memory Type: Flash
• Program Memory Size: 128KB
• Total Internal Ram Size: 4KB
• # I/os (max): 60
• Number Of Timers - General Purpose: 8
• Operating Supply Voltage (typ): 2.5/5V
• Operating Supply Voltage (max): 2.75/5.5V
• Operating Supply Voltage (min): 2.35/2.97V
• On-chip Adc: 8-chx10-bit
• Instruction Set Architecture: CISC
• Operating Temp Range: -40C to 105C
• Operating Temperature Classification: Industrial
• Mounting: Surface Mount
• Pin Count: 80
• Package Type: PQFP
• Lead Free Status / Rohs Status: Not Compliant

C.1.2
Freescale Semiconductor
SEATING
PLANE
-H-
-T-
-L-
52-Pin LQFP Package
C
13
1
4X
52
14
Figure C-2. 52-Pin LQFP Mechanical Dimensions (Case no. 848D-03)
0.20 (0.008) H L-M
S1
C2
A1
C1
VIEW AA
0.05 (0.002)
A
S
3X
4X
4X
-N-
N
VIEW Y
θ2
θ3
S
MC9S12C-Family / MC9S12GC-Family
40
26
Z
39
27
E
K
W
4X 13 TIPS
θ1
0.20 (0.008) T L-M
-M-
θ
Rev 01.24
B1
VIEW AA
2X R
V1
GAGE PLANE
0.10 (0.004) T
0.25 (0.010)
R1
B
V
N
NOTES:
1.
2.
C L
PLATING
DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982.
CONTROLLING DIMENSION: MILLIMETER
DATUM PLANE -H- IS LOCATED AT BOTTOM OF LEAD AND IS COINCIDENT
WITH THE LEAD WHERE THE LEAD EXITS THE PLASTIC BODY AT THE
BOTTOM OF THE PARTING LINE.
DATUMS -L-, -M- AND -N- TO BE DETERMINED AT DATUM PLANE -H-.
DIMENSIONS S AND V TO BE DETERMINED AT SEATING PLANE -T-.
DIMENSIONS A AND B DO NOT INCLUDE MOLD PROTRUSION.
ALLOWABLE PROTRUSION IS 0.25 (0.010) PER SIDE. DIMENSIONS A AND
B DO INCLUDE MOLD MISMATCH AND ARE DETERMINED AT DATUM
PLANE -H-
DIMENSION D DOES NOT INCLUDE DAMBAR PROTRUSION. DAMBAR
PROTRUSION SHALL NOT CAUSE THE LEAD WIDTH TO EXCEED 0.46
(0.018). MINIMUM SPACE BETWEEN PROTRUSION AND ADJACENT LEAD
OR PROTRUSION 0.07 (0.003).
0.13 (0.005)
ROTATED 90
DIM
θ2
A1
B1
C1
C2
R1
S1
V1
θ1
θ3
W
A
B
C
D
E
G
K
S
U
V
θ
F
J
Z
J
SECTION AB-AB
AB
AB
MILLIMETERS
MIN
0.05
1.30
0.20
0.45
0.22
0.07
0.08
0.09
10.00 BSC
10.00 BSC
12.00 BSC
12.00 BSC
0
0
5.00 BSC
5.00 BSC
0.65 BSC
0.50 REF
6.00 BSC
6.00 BSC
0.20 REF
1.00 REF
---
12
12
Appendix C Package Information
°
°
°
°
VIEW Y
M
REF
REF
D
°
MAX
F
1.70
0.20
1.50
0.40
0.75
0.35
0.20
0.20
0.16
7
---
T
CLOCKWISE
°
L-M
0.002
0.051
0.008
0.018
0.009
0.003
0.003
0.004
MIN
0.394 BSC
0.197 BSC
0.394 BSC
0.197 BSC
0.026 BSC
0.020 REF
0.472 BSC
0.236 BSC
0.472 BSC
0.236 BSC
0.008 REF
0.039 REF
0
0
---
12
INCHES
°
°
12
S
°
°
U
REF
REF
0.008
N
0.067
0.059
0.016
0.030
0.014
0.008
0.008
0.006
MAX
BASE METAL
---
7
°
X=L, M, N
S
G
-X-
683