MC9S12C128VFU Freescale Semiconductor, MC9S12C128VFU Datasheet - Page 653

MC9S12C128VFU

Manufacturer Part Number
MC9S12C128VFU
Description
Manufacturer
Freescale Semiconductor
Datasheet

Specifications of MC9S12C128VFU

Cpu Family
HCS12
Device Core Size
16b
Frequency (max)
25MHz
Interface Type
CAN/SCI/SPI
Program Memory Type
Flash
Program Memory Size
128KB
Total Internal Ram Size
4KB
# I/os (max)
60
Number Of Timers - General Purpose
8
Operating Supply Voltage (typ)
2.5/5V
Operating Supply Voltage (max)
2.75/5.5V
Operating Supply Voltage (min)
2.35/2.97V
On-chip Adc
8-chx10-bit
Instruction Set Architecture
CISC
Operating Temp Range
-40C to 105C
Operating Temperature Classification
Industrial
Mounting
Surface Mount
Pin Count
80
Package Type
PQFP
Lead Free Status / Rohs Status
Not Compliant

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1. The values for thermal resistance are achieved by package simulations
2. PC Board according to EIA/JEDEC Standard 51-2
3. PC Board according to EIA/JEDEC Standard 51-7
Freescale Semiconductor
Num
10
11
12
13
14
15
1
2
3
4
5
6
7
8
9
C
T
T
T
T
T
T
T
T
T
T
T
T
T
T
T
Thermal Resistance LQFP48, single layer PCB
Thermal Resistance LQFP48, double sided PCB
with 2 internal planes
Junction to Board LQFP48
Junction to Case LQFP48
Junction to Package Top LQFP48
Thermal Resistance LQFP52, single sided PCB
Thermal Resistance LQFP52, double sided PCB
with 2 internal planes
Junction to Board LQFP52
Junction to Case LQFP52
Junction to Package Top LQFP52
Thermal Resistance QFP 80, single sided PCB
Thermal Resistance QFP 80, double sided PCB
with 2 internal planes
Junction to Board QFP80
Junction to Case QFP80
Junction to Package Top QFP80
Table A-5. Thermal Package Characteristics
(3)
Rating
MC9S12C-Family / MC9S12GC-Family
Rev 01.24
(2)
Symbol
Ψ
Ψ
Ψ
θ
θ
θ
θ
θ
θ
θ
θ
θ
θ
θ
θ
JC
JC
JC
JA
JA
JB
JA
JA
JB
JA
JA
JB
JT
JT
JT
(1)
Min
Appendix A Electrical Characteristics
Typ
Max
69
53
30
20
65
49
31
17
52
42
28
18
4
3
4
o
o
o
o
o
o
o
o
o
o
o
o
o
o
o
Unit
C/W
C/W
C/W
C/W
C/W
C/W
C/W
C/W
C/W
C/W
C/W
C/W
C/W
C/W
C/W
653

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