IXB28504XGBEFS Intel, IXB28504XGBEFS Datasheet - Page 55

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IXB28504XGBEFS

Manufacturer Part Number
IXB28504XGBEFS
Description
Manufacturer
Intel
Datasheet

Specifications of IXB28504XGBEFS

Lead Free Status / Rohs Status
Compliant
Hardware Management—IXB2850
4.7.1.2
Figure 19.
4.7.2
Note:
January 2007
Document Number: 05-2443-006
ShMC sensor number
Sensor Map Building
The BMC builds the Sensor Map table based on the Sensor Device Records (SDRs)
taken from all IXB2850 board hardware modules. For this purpose, the BMC uses the
sensor device definitions taken from the hardware module FRU Information.
shows the Sensor Map entry build process.
Sensor map entry building process
Note that a bus number is determined by the BMC based on the SDR and a FRU
Information read operation and the number of the bus (for example, local I
from which a given SDR has been read.
Sensor Devices
The BMC supports different sensor devices located on an IXB2850 baseboard and its
extension cards:
† On IXB2850 baseboards, current is monitored using voltage sensors.
All sensor devices placed on a particular hardware module are described by the Sensor
Data Record (SDR) included in the FRU Information for the referenced hardware
module (see
(8 bits)
• Temperature monitoring sensors (AD7416)
• Temperature monitoring sensor (ADM1031)
• Temperature and voltage sensor (AD7417)†
Read SDR & FRU
Section 4.7.3
Table index
Device type
following).
(8 bits)
Device ID
(8 bits)
Sensor device FRU OEM record
Device address
Device type
(32 bits)
BMC sensor map entry
Sensor number from SDR
Device ID
(8 bits)
(5 bits)
Intel NetStructure
Device address
Device node
Bus number
(3 bits)
(8 bits)
(32 bits)
®
IXB2850 Packet Processing Boards
Device node
(8 bits)
2
C bus)
Figure 19
TPS
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