UPD70F3768GF-GAT-AX Renesas Electronics America, UPD70F3768GF-GAT-AX Datasheet - Page 1359
![no-image](/images/manufacturer_photos/0/5/560/renesas_electronics_america_sml.jpg)
UPD70F3768GF-GAT-AX
Manufacturer Part Number
UPD70F3768GF-GAT-AX
Description
MCU 32BIT V850ES/JX3-U 128-LQFP
Manufacturer
Renesas Electronics America
Series
V850ES/Jx3-Ur
Datasheet
1.UPD70F3763GC-UEU-AX.pdf
(1411 pages)
Specifications of UPD70F3768GF-GAT-AX
Core Processor
RISC
Core Size
32-Bit
Speed
48MHz
Connectivity
CSI, EBI/EMI, I²C, UART/USART, USB
Peripherals
DMA, LVD, PWM, WDT
Number Of I /o
96
Program Memory Size
384KB (384K x 8)
Program Memory Type
FLASH
Ram Size
48K x 8
Voltage - Supply (vcc/vdd)
2.85 V ~ 3.6 V
Data Converters
A/D 12x10b; D/A 2x8b
Oscillator Type
Internal
Operating Temperature
-40°C ~ 85°C
Package / Case
*
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Eeprom Size
-
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Company:
Part Number:
UPD70F3768GF-GAT-AX
Manufacturer:
Renesas Electronics America
Quantity:
10 000
- Current page: 1359 of 1411
- Download datasheet (8Mb)
V850ES/JG3-U, V850ES/JH3-U
sales representative.
Note
Caution Do not use different soldering methods together (except for partial heating).
Remarks 1. Products with –AX at the end of the part number are lead-free products.
R01UH0043EJ0300 Rev.3.00
Sep 30, 2010
Infrared reflow
Partial heating
Remark Evaluation of the soldering conditions for the (A) standard products is incomplete because these products are
Soldering Method
These products should be soldered and mounted under the following recommended conditions.
For soldering methods and conditions other than those recommended below, please contact an Renesas Electronics
For technical information, see the following website.
Semiconductor Device Mount Manual (http://www2.renesas.com/pkg/en/mount/index.html)
μ
PD70F3764GC-UEU-AX: 100-pin plastic LQFP (fine pitch) (14 × 14 mm)
μ
PD70F3763GC-UEU-AX: 100-pin plastic LQFP (fine pitch) (14 × 14 mm)
After opening the dry pack, store it at 25°C or less and 65% RH or less for the allowable storage period.
2. For soldering methods and conditions other than those recommended, please contact an Renesas
under development.
Electronics sales representative.
Package peak temperature: 260°C, Time: 60 seconds max. (at 220°C or higher),
Count: 3 times or less, Exposure limit: 7 days
20 to 72 hours)
Pin temperature: 350°C max., Time: 3 seconds max. (per pin row)
CHAPTER 35 RECOMMENDED SOLDERING CONDITIONS
Table 35-1. Surface Mounting Type Soldering Conditions (1/2)
Soldering Conditions
CHAPTER 35 RECOMMENDED SOLDERING CONDITIONS
Note
(after that, prebake at 125°C for
IR60-207-3
Condition Symbol
Recommended
Page 1359 of 1408
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