MT47H64M8CB-5E:B Micron Technology Inc, MT47H64M8CB-5E:B Datasheet - Page 130

• Manufacturer Part Number: MT47H64M8CB-5E:B
• Description: IC DDR2 SDRAM 512MBIT 5NS 60FBGA
• Manufacturer: Micron Technology Inc

Specifications of MT47H64M8CB-5E:B

• Format - Memory: RAM
• Memory Type: DDR2 SDRAM
• Memory Size: 512M (64M x 8)
• Speed: 5ns
• Interface: Parallel
• Voltage - Supply: 1.7 V ~ 1.9 V
• Operating Temperature: 0°C ~ 85°C
• Package / Case: 60-FBGA
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant

Package Dimensions
Figure 88:
PDF: 09005aef8117c18e, Source: 09005aef8211b2e6
512MbDDR2_2.fm - Rev. K 8/06 EN
SEATING
PLANE
11.20
SOLDER BALL
DIAMETER REFERS
TO POST-REFLOW
CONDITION.
0.10 C
BALL A9
84X Ø0.45
5.60
C
84-Ball FBGA Package – 12mm x 12.5mm (x16)
Note:
3.20
12.00 ±0.10
1.80 ±0.05
6.40
CTR
C L
0.80
TYP
All dimensions are in millimeters.
6.00 ±0.05
0.80 TYP
C L
BALL A1
6.25 ±0.05
0.80 ±0.05
BALL A1 ID
0.155 ±0.013
130
12.50 ±0.10
Micron Technology, Inc., reserves the right to change products or specifications without notice.
1.20 MAX
512Mb: x4, x8, x16 DDR2 SDRAM
SOLDER BALL MATERIAL:
SOLDER BALL PAD:
SUBSTRATE MATERIAL: PLASTIC LAMINATE
MOLD COMPOUND: EPOXY NOVALAC
96.5% Sn, 3% Ag, 0.5% Cu
Ø0.33 NON SOLDER MASK DEFINED
Package Dimensions
BALL A1 ID
©2004 Micron Technology, Inc. All rights reserved.