MC68HC08AZ60ACFU MOTOROLA [Motorola, Inc], MC68HC08AZ60ACFU Datasheet - Page 459

• Manufacturer Part Number: MC68HC08AZ60ACFU
• Description: Microcontrollers
• Manufacturer: MOTOROLA [Motorola, Inc]

25.14 Mechanical Specifications
25.14.1 64-pin Quad Flat Pack (QFP)
MC68HC08AZ60A — Rev 0.0
MOTOROLA
L
Seating
Plane
-C-
E
- A -
C
H
Dim.
49
64
A
B
C
D
E
G
H
K
F
J
L
1
48
G
13.90
13.90
Min.
2.15
0.30
2.00
0.30
0.13
0.65
—
12.00 REF
- D -
0.80 BSC
0.20 M C A – B S D S
0.05 A – B
0.20 M H A – B S D S
Figure 25-5. 64-pin QFP (Case #840B)
14.10
14.10
Max.
2.45
0.45
2.40
0.40
0.25
0.23
0.95
L
A
S
1. Datum Plane –H– is located at bottom of lead and is coincident with
2. Datums A–B and –D to be determined at Datum Plane –H–.
3. Dimensions S and V to be determined at seating plane –C–.
4. Dimensions A and B do not include mould protrusion. Allowable
5. Dimension D does not include dambar protrusion. Allowable
6. Dimensions and tolerancing per ANSI Y 14.5M, 1982.
7. All dimensions in mm.
Detail “A”
the lead where the lead exits the plastic body at the bottom of the
parting line.
mould protrusion is 0.25mm per side. Dimensions A and B do
include mould mismatch and are determined at Datum Plane –H–.
dambar protrusion shall be 0.08 total in excess of the D dimension
at maximum material condition. Dambar cannot be located on the
lower radius or the foot.
Electrical Specifications
33
16
32
17
M
M
-H-
- B -
Detail “C”
Notes
Datum
Plane
B
V
Dim.
M
W
N
Q
R
U
J
P
S
T
V
X
W
0.20 M C A – B S D S
Mechanical Specifications
U
Electrical Specifications
16.95
16.95
Min.
0.13
0.13
0.13
0.35
Section B–B
5
0
0
0.40 BSC
1.6 REF
Advance Information
B
B
F
D
X
Detail “A”
K
17.45
17.45
Max.
0.17
0.30
0.45
10
7
—
—
N
- A, B, D -
R
T
Metal
Base
Q
P
459